Inventor
KAPLAN ALEXANDER F
US4 patents
Patents
4 patentsUS10319625B2Jun 11, 2019
Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures
INTEL CORP7 citations81
US12308284B2May 20, 2025
Plug and trench architectures for integrated circuits and methods of manufacture
INTEL CORP0 citations59
US11171043B2Nov 9, 2021
Plug and trench architectures for integrated circuits and methods of manufacture
INTEL CORP0 citations59
US10636700B2Apr 28, 2020
Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures
INTEL CORP0 citations49