Inventor

HURWITZ DROR

CN52 patents

⚠️ This page may combine multiple inventors who share the name “HURWITZ DROR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HURWITZ DROR

ZHUHAI CRYSTAL RESONANCE TECH CO LTD

Method of fabricating novel packages for electronic components

Single crystal piezoelectric RF resonators and filters with improved cavity definition

Single crystal piezoelectric RF resonators and filters

RF resonators and filters

Method for fabricating single crystal piezoelectric RF resonators and filters with improved cavity definition

Method for packaging an electronic component in a package with an organic back end

Packages with organic back ends for electronic components

Packaged electronic components

FBAR filter with trap rich layer

Packaged electronic components

Hybrid band-pass filter with integrated passive device and acoustic resonator

RF resonator membranes and methods of construction

Film bulk acoustic wave resonator with bifurcated electrode

HURWITZ DROR

RF resonators and filters

Multilayer electronic structure with stepped holes

Method of fabrication for single crystal piezoelectric RF resonators and filters

Multilayer electronic support structure with integral constructional elements

Multilayer electronic structures with integral vias extending in in-plane direction

Multilayer electronic structure with integral stepped stacked structures

Multilayer electronic support structure with cofabricated metal core

Multilayer electronic structures with vias having different dimensions

Multilayer electronic structure with novel transmission lines

Multilayer electronic structure with through thickness coaxial structures

Alignment between layers of multilayer electronic support structures

Method for fabricating RF resonators and filters

ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECH CO LTD

Method of fabricating a polymer frame with a rectangular array of cavities

Multilayer electronic structures with embedded filters

Multilayer electronic structures with embedded filters

Embedded packages

Chip package

Interposer frame with polymer matrix and methods of fabrication

Terminations

Composite electronic structure with partially exposed and protruding copper termination posts

Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor

Chip package

Substrates with ultra fine pitch flip chip bumps

AMITEC ADVANCED MULTILAYER INT

Coreless cavity substrates for chip packaging and their fabrication

Process for manufacturing a chip carrier substrate

Chip carrier substrate

Electronic interconnect structure and method for manufacturing it

Advanced multilayer coreless support structures and method for their fabrication

Integrated circuit support structures and their fabrication

ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTD

Film bulk acoustic resonator filter

Thin film capacitors embedded in polymer dielectric

Method for fabricating embedded chips

Terminations and couplings between chips and substrates

Method of fabrication, a multilayer electronic structure and structures in accordance with the method

Single layer coreless substrate

P C B LTD

Method for manufacturing an electronic structure

CRYSTAL WAVES LABS LTD

RF resonator electrode and membrane combinations and method of fabrication