Inventor

SHEU JYH-CHERNG

TW48 patents

⚠️ This page may combine multiple inventors who share the name “SHEU JYH-CHERNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHEU JYH-CHERNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor Fin FET device with epitaxial source/drain

Metal liner overhang reduction and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Methods for forming STI regions in integrated circuits

Laser de-bonding carriers and composite carriers thereof

Wrap-around contact plug and method manufacturing same

Wrap-around contact plug and method manufacturing same

Semiconductor Fin FET device with epitaxial source/drain

Semiconductor Fin FET device with epitaxial source/drain

Ion implantation with annealing for substrate cutting

Formation method of interconnection structure of semiconductor device

Semiconductor device having multi-layer epitaxial structures with different lattice constants

Semiconductor device and manufacturing method thereof

Bonding system with sealing gasket and method for using the same

Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structure

Laser de-bonding carriers and composite carriers thereof

Ion implantation with annealing for substrate cutting

Bonding system with sealing gasket and method for using the same

Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof

Method and system for bonding

Metal adhesion layer to promote metal plug adhesion

Forming STI regions to separate semiconductor Fins

Semiconductor device having a uniform and thin silicide layer on an epitaxial source/ drain structure and manufacturing method thereof

Dynamic bonding gap control and tool for wafer bonding

Wafer bonding apparatus and method

Heat dissipation for semiconductor devices and methods of manufacture

Bonding system and method for using the same

Wrap-around contact plug and method manufacturing same

Wrap-around contact plug and method manufacturing same

Temperature controllable bonder equipment for substrate bonding

Wafer bonding system and method of using the same

Temperature controlled loadlock chamber

OPTOMEC DESIGN

Direct write# system

Apparatuses and methods for maskless mesoscale material deposition

Laser processing for heat-sensitive mesoscale deposition

Direct write™ system

Annular aerosol jet deposition using an extended nozzle

RENN MICHAEL J

Apparatuses and methods for maskless mesoscale material deposition

Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials

OPTOMEC INC

Apparatuses and methods for maskless mesoscale material deposition

TAIWAN SEMICONDUCTOR MFG

Heat spreader structures in scribe lines

CHEN HSIEN-WEI

Heat spreader structures in scribe lines

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Carrier structure and methods of forming the same

YU CHEN-HUA

Self-aligned halo/pocket implantation for reducing leakage and source/drain resistance in MOS devices

LIN CHUN-HSIEN

Temperature controlled loadlock chamber

HSIAO YI-LI

PVD target with end of service life detection capability