Inventor
CHIA LEONG YAP
SG14 patents
⚠️ This page may combine multiple inventors who share the name “CHIA LEONG YAP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
13 patentsUS10026476B2Jul 17, 2018
Bi-polar memristor
HEWLETT PACKARD DEVELOPMENT CO2 citations71
US9987842B2Jun 5, 2018
Printhead with a number of memristors and inverters
HEWLETT PACKARD DEVELOPMENT CO2 citations70
US10170180B2Jan 1, 2019
Memory including bi-polar memristor
HEWLETT PACKARD DEVELOPMENT CO2 citations69
US10224935B2Mar 5, 2019
Ratioed logic with a high impedance load
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10071552B2Sep 11, 2018
Sensing a property of a fluid
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10081178B2Sep 25, 2018
Addressing an EPROM
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US9953991B2Apr 24, 2018
EPROM cell with modified floating gate
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US9919517B2Mar 20, 2018
Addressing an EPROM on a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US10618301B2Apr 14, 2020
Semiconductor device including capacitive sensor and ion-sensitive transistor for determining level and ion-concentration of fluid
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US10084062B2Sep 25, 2018
Semiconductor device comprising a gate formed from a gate ring
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US9950520B2Apr 24, 2018
Printhead having a number of single-dimensional memristor banks
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US10224335B2Mar 5, 2019
Integrated circuits
HEWLETT PACKARD DEVELOPMENT CO0 citations40
US10173420B2Jan 8, 2019
Printhead assembly
HEWLETT PACKARD DEVELOPMENT CO0 citations40