Inventor

KOYAMA LINDA J

US2 patents

Patents

2 patents

US4481070ANov 6, 1984

Double planarization process for multilayer metallization of integrated circuit structures

ADVANCED MICRO DEVICES INC28 citations89

US4789760ADec 6, 1988

Via in a planarized dielectric and process for producing same

ADVANCED MICRO DEVICES INC22 citations80