Inventor
WACHI HIROSHI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “WACHI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASAHI GLASS CO LTD
8 patentsUS4418186ANov 29, 1983
Copolymer for fluorine-containing elastomer having excellent low temperature resistance and alcohol resistance
ASAHI GLASS CO LTD63 citations96
US6833665B2Dec 21, 2004
Flat display panel with a front protection plate
ASAHI GLASS CO LTD45 citations92
US4645799AFeb 24, 1987
Curable composition of elastomeric vinylidene fluoride copolymer
ASAHI GLASS CO LTD39 citations92
US4758618AJul 19, 1988
Curable composition of elastomeric vinylidene fluoride copolymer
ASAHI GLASS CO LTD44 citations91
US4619983AOct 28, 1986
Copolymer for fluorine-containing elastomer having excellent low temperature resistance and alcohol resistance
ASAHI GLASS CO LTD23 citations82
US4910260AMar 20, 1990
Vulcanizable fluororubber composition
ASAHI GLASS CO LTD16 citations74
US4730029AMar 8, 1988
Flame-retardant resin
ASAHI GLASS CO LTD9 citations70
US6982023B2Jan 3, 2006
Electromagnetic wave shielding filter and its production process
ASAHI GLASS CO LTD4 citations62
HITACHI LTD
5 patentsUS4280137AJul 21, 1981
Method and apparatus for automatically controlling arc welding
HITACHI LTD144 citations95
US4996589AFeb 26, 1991
Semiconductor module and cooling device of the same
HITACHI LTD30 citations91
US4740866AApr 26, 1988
Sealed-type liquid cooling device with expandable bellow for semiconductor chips
HITACHI LTD52 citations90
US4809058AFeb 28, 1989
Integrated circuit device
HITACHI LTD20 citations81
US4436982AMar 13, 1984
Two electrode welding with different currents supplied to the electrodes
HITACHI LTD21 citations76
ELECTROPLATING ENG
5 patentsUS5614004AMar 25, 1997
Electroless gold plating solution
ELECTROPLATING ENG18 citations91
US5601637AFeb 11, 1997
Electroless gold plating solution
ELECTROPLATING ENG3 citations61
US5560764AOct 1, 1996
Electroless gold plating solution
ELECTROPLATING ENG2 citations61
US7887692B2Feb 15, 2011
Palladium plating solution
ELECTROPLATING ENG1 citations51
US5691003ANov 25, 1997
Plating method by means of an electroless gold plating solution and system therefor
ELECTROPLATING ENG1 citations51