Inventor

BENCHER CHRISTOPHER DENNIS

US79 patents

⚠️ This page may combine multiple inventors who share the name “BENCHER CHRISTOPHER DENNIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BENCHER CHRISTOPHER DENNIS

APPLIED MATERIALS INC

Method for fabricating a gate structure of a field effect transistor

Removable amorphous carbon CMP stop

Method and apparatus for reducing copper oxidation and contamination in a semiconductor device

Integral patterning of large features along with array using spacer mask patterning process flow

Method for depositing an amorphous carbon layer

Method of depositing an amorphous carbon layer

Method of depositing an amorphous carbon layer

Removable amorphous carbon CMP stop

Method of depositing an amorphous carbon layer

Plasma treatment for copper oxide reduction

Photolithography scheme using a silicon containing resist

Photolithography scheme using a silicon containing resist

Nitrogen-free antireflective coating for use with photolithographic patterning

Half tone scheme for maskless lithography

Collimated OLED light field display

Localized stress modulation for overlay and EPE

Optically tuned hardmask for multi-patterning applications

Resist hardening and development processes for semiconductor device manufacturing

Optically tuned hardmask for multi-patterning applications

Frequency doubling using a photo-resist template mask

Methods and devices to reduce defects in dielectric stack structures

Image stabilization for digital lithography

Removable amorphous carbon CMP stop

Semiconductor device having reduced oxidation interface

Collimated LED light field display

Reserving spatial light modulator sections to address field non-uniformities

Half tone scheme for maskless lithography

Collimated, directional micro-LED light field display

Method to reduce line waviness

Method to reduce line waviness

Reticle fabrication using a removable hard mask

Extreme ultraviolet (EUV) substrate inspection system with simplified optics and method of manufacturing thereof

Ashable layers for reducing critical dimensions of integrated circuit features

Digital lithography with extended depth of focus

Methods for reducing semiconductor substrate strain variation

Manufacturing micro-LED displays to reduce subpixel crosstalk

Micro LED array illumination source

Method to reduce line waviness

Removable amorphous carbon CMP stop

Micro-LED displays to reduce subpixel crosstalk

Method to achieve non-crystalline evenly distributed shot pattern for digital lithography

Wire grid polarizer manufacturing methods using frequency doubling interference lithography

Method of building a 3D functional optical material layer stacking structure

Half tone scheme for maskless lithography

Reserving spatial light modulator sections to address field non-uniformities

Line edge roughness reduction via step size alteration

Method for critical dimension reduction using conformal carbon films

Quarter wave light splitting

Dynamic surface annealing of implanted dopants with low temperature HDPCVD process for depositing a high extinction coefficient optical absorber layer

MEBARKI BENCHERKI

Self-aligned multi-patterning for advanced critical dimension contacts