Inventor

OBERMAIER HANNSJOERG

US4 patents

⚠️ This page may combine multiple inventors who share the name “OBERMAIER HANNSJOERG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

3 patents

US6496375B2Dec 17, 2002

Cooling arrangement for high density packaging of electronic components

HEWLETT PACKARD CO83 citations94

US5430611AJul 4, 1995

Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate

HEWLETT PACKARD CO83 citations94

US6600220B2Jul 29, 2003

Power distribution in multi-chip modules

HEWLETT PACKARD CO51 citations90

HEWLETT PACKARD DEVELOPMENT CO

1 patent

US6687126B2Feb 3, 2004

Cooling plate arrangement for electronic components

HEWLETT PACKARD DEVELOPMENT CO56 citations94