Inventor
HSUE CHEN-CHIU
TW97 patents
⚠️ This page may combine multiple inventors who share the name “HSUE CHEN-CHIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
37 patentsUS5716884AFeb 10, 1998
Process for fabricating a stacked capacitor
UNITED MICROELECTRONICS CORP57 citations96
US5698458ADec 16, 1997
Multiple well device and process of manufacture
UNITED MICROELECTRONICS CORP67 citations96
US5667940ASep 16, 1997
Process for creating high density integrated circuits utilizing double coating photoresist mask
UNITED MICROELECTRONICS CORP96 citations96
US5559352ASep 24, 1996
ESD protection improvement
UNITED MICROELECTRONICS CORP70 citations96
US5510279AApr 23, 1996
Method of fabricating an asymmetric lightly doped drain transistor device
UNITED MICROELECTRONICS CORP75 citations96
US5418176AMay 23, 1995
Process for producing memory devices having narrow buried N+ lines
UNITED MICROELECTRONICS CORP88 citations96
US5946571AAug 31, 1999
Method of forming a capacitor
UNITED MICROELECTRONICS CORP45 citations93
US5734200AMar 31, 1998
Polycide bonding pad structure
UNITED MICROELECTRONICS CORP43 citations93
US5712500AJan 27, 1998
Multiple cell with common bit line contact and method of manufacture thereof
UNITED MICROELECTRONICS CORP24 citations93
US5661081AAug 26, 1997
Method of bonding an aluminum wire to an intergrated circuit bond pad
UNITED MICROELECTRONICS CORP24 citations93
US5516713AMay 14, 1996
Method of making high coupling ratio NAND type flash memory
UNITED MICROELECTRONICS CORP33 citations93
US5484743AJan 16, 1996
Self-aligned anti-punchthrough implantation process
UNITED MICROELECTRONICS CORP21 citations93
US5480822AJan 2, 1996
Method of manufacture of semiconductor memory device with multiple, orthogonally disposed conductors
UNITED MICROELECTRONICS CORP28 citations93
US5460999AOct 24, 1995
Method for making fin-shaped stack capacitors on DRAM chips
UNITED MICROELECTRONICS CORP39 citations93
US5455444AOct 3, 1995
Double polysilicon electrostatic discharge protection device for SRAM and DRAM memory devices
UNITED MICROELECTRONICS CORP34 citations93
US5436186AJul 25, 1995
Process for fabricating a stacked capacitor
UNITED MICROELECTRONICS CORP27 citations93
US5434108AJul 18, 1995
Grounding method to eliminate the antenna effect in VLSI process
UNITED MICROELECTRONICS CORP21 citations93
US5430328AJul 4, 1995
Process for self-align contact
UNITED MICROELECTRONICS CORP37 citations93
US5429980AJul 4, 1995
Method of forming a stacked capacitor using sidewall spacers and local oxidation
UNITED MICROELECTRONICS CORP30 citations93
US5416036AMay 16, 1995
Method of improvement ESD for LDD process
UNITED MICROELECTRONICS CORP25 citations93
US5393233AFeb 28, 1995
Process for fabricating double poly high density buried bit line mask ROM
UNITED MICROELECTRONICS CORP26 citations93
US5380673AJan 10, 1995
Dram capacitor structure
UNITED MICROELECTRONICS CORP34 citations93
US5374565ADec 20, 1994
Method for ESD protection improvement
UNITED MICROELECTRONICS CORP40 citations93
US5924006AJul 13, 1999
Trench surrounded metal pattern
UNITED MICROELECTRONICS CORP44 citations92
US5554560ASep 10, 1996
Method for forming a planar field oxide (fox) on substrates for integrated circuit
UNITED MICROELECTRONICS CORP22 citations92
US5429975AJul 4, 1995
Method of implanting during manufacture of ROM device
UNITED MICROELECTRONICS CORP25 citations92
US5413950AMay 9, 1995
Method of forming a DRAM stacked capacitor cell
UNITED MICROELECTRONICS CORP45 citations90
US5496776AMar 5, 1996
Spin-on-glass planarization process with ion implantation
UNITED MICROELECTRONICS CORP37 citations89
US5915201AJun 22, 1999
Trench surrounded metal pattern
UNITED MICROELECTRONICS CORP18 citations84
US5668031ASep 16, 1997
Method of fabricating high density flat cell mask ROM
UNITED MICROELECTRONICS CORP18 citations84
US5625213AApr 29, 1997
Top floating-gate flash EEPROM structure
UNITED MICROELECTRONICS CORP17 citations82
US5585656ADec 17, 1996
High coupling ratio of flash memory
UNITED MICROELECTRONICS CORP16 citations82
US5882970AMar 16, 1999
Method for fabricating flash memory cell having a decreased overlapped region between its source and gate
UNITED MICROELECTRONICS CORP15 citations74
US5858826AJan 12, 1999
Method of making a blanket N-well structure for SRAM data stability in P-type substrates
UNITED MICROELECTRONICS CORP13 citations74
US5750438AMay 12, 1998
Method for fabricating a local interconnection structure
UNITED MICROELECTRONICS CORP7 citations74
US5594684AJan 14, 1997
Polysilicon programming memory cell
UNITED MICROELECTRONICS CORP5 citations74
US5578857ANov 26, 1996
Double poly high density buried bit line mask ROM
UNITED MICROELECTRONICS CORP13 citations74
SILICON INTEGRATED SYS CORP
10 patentsUS6696222B2Feb 24, 2004
Dual damascene process using metal hard mask
SILICON INTEGRATED SYS CORP101 citations98
US6521523B2Feb 18, 2003
Method for forming selective protection layers on copper interconnects
SILICON INTEGRATED SYS CORP51 citations92
US6492226B1Dec 10, 2002
Method for forming a metal capacitor in a damascene process
SILICON INTEGRATED SYS CORP27 citations92
US6483142B1Nov 19, 2002
Dual damascene structure having capacitors
SILICON INTEGRATED SYS CORP22 citations92
US6391713B1May 21, 2002
Method for forming a dual damascene structure having capacitors
SILICON INTEGRATED SYS CORP22 citations92
US6338999B1Jan 15, 2002
Method for forming metal capacitors with a damascene process
SILICON INTEGRATED SYS CORP21 citations92
US6649512B1Nov 18, 2003
Method for improving adhesion of a low k dielectric to a barrier layer
SILICON INTEGRATED SYS CORP13 citations84
US6358792B1Mar 19, 2002
Method for fabricating metal capacitor
SILICON INTEGRATED SYS CORP15 citations84
US6410386B1Jun 25, 2002
Method for forming a metal capacitor in a damascene process
SILICON INTEGRATED SYS CORP20 citations81
US6495877B1Dec 17, 2002
Metal capacitors with damascene structures and method for forming the same
SILICON INTEGRATED SYS CORP13 citations74
SILICON INTERGRATED SYSTEMS CO
1 patentPOWERCHIP SEMICONDUCTOR CORP
1 patentUNITED MICROELECTRONICS COPORA
1 patentShowing the top 50 of 97 patents by PatentIndex Score.