P

Inventor

HSUE CHEN-CHIU

TW97 patents
⚠️ This page may combine multiple inventors who share the name “HSUE CHEN-CHIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

37 patents
US5716884AFeb 10, 1998

Process for fabricating a stacked capacitor

UNITED MICROELECTRONICS CORP57 citations96
US5698458ADec 16, 1997

Multiple well device and process of manufacture

UNITED MICROELECTRONICS CORP67 citations96
US5667940ASep 16, 1997

Process for creating high density integrated circuits utilizing double coating photoresist mask

UNITED MICROELECTRONICS CORP96 citations96
US5559352ASep 24, 1996

ESD protection improvement

UNITED MICROELECTRONICS CORP70 citations96
US5510279AApr 23, 1996

Method of fabricating an asymmetric lightly doped drain transistor device

UNITED MICROELECTRONICS CORP75 citations96
US5418176AMay 23, 1995

Process for producing memory devices having narrow buried N+ lines

UNITED MICROELECTRONICS CORP88 citations96
US5946571AAug 31, 1999

Method of forming a capacitor

UNITED MICROELECTRONICS CORP45 citations93
US5734200AMar 31, 1998

Polycide bonding pad structure

UNITED MICROELECTRONICS CORP43 citations93
US5712500AJan 27, 1998

Multiple cell with common bit line contact and method of manufacture thereof

UNITED MICROELECTRONICS CORP24 citations93
US5661081AAug 26, 1997

Method of bonding an aluminum wire to an intergrated circuit bond pad

UNITED MICROELECTRONICS CORP24 citations93
US5516713AMay 14, 1996

Method of making high coupling ratio NAND type flash memory

UNITED MICROELECTRONICS CORP33 citations93
US5484743AJan 16, 1996

Self-aligned anti-punchthrough implantation process

UNITED MICROELECTRONICS CORP21 citations93
US5480822AJan 2, 1996

Method of manufacture of semiconductor memory device with multiple, orthogonally disposed conductors

UNITED MICROELECTRONICS CORP28 citations93
US5460999AOct 24, 1995

Method for making fin-shaped stack capacitors on DRAM chips

UNITED MICROELECTRONICS CORP39 citations93
US5455444AOct 3, 1995

Double polysilicon electrostatic discharge protection device for SRAM and DRAM memory devices

UNITED MICROELECTRONICS CORP34 citations93
US5436186AJul 25, 1995

Process for fabricating a stacked capacitor

UNITED MICROELECTRONICS CORP27 citations93
US5434108AJul 18, 1995

Grounding method to eliminate the antenna effect in VLSI process

UNITED MICROELECTRONICS CORP21 citations93
US5430328AJul 4, 1995

Process for self-align contact

UNITED MICROELECTRONICS CORP37 citations93
US5429980AJul 4, 1995

Method of forming a stacked capacitor using sidewall spacers and local oxidation

UNITED MICROELECTRONICS CORP30 citations93
US5416036AMay 16, 1995

Method of improvement ESD for LDD process

UNITED MICROELECTRONICS CORP25 citations93
US5393233AFeb 28, 1995

Process for fabricating double poly high density buried bit line mask ROM

UNITED MICROELECTRONICS CORP26 citations93
US5380673AJan 10, 1995

Dram capacitor structure

UNITED MICROELECTRONICS CORP34 citations93
US5374565ADec 20, 1994

Method for ESD protection improvement

UNITED MICROELECTRONICS CORP40 citations93
US5924006AJul 13, 1999

Trench surrounded metal pattern

UNITED MICROELECTRONICS CORP44 citations92
US5554560ASep 10, 1996

Method for forming a planar field oxide (fox) on substrates for integrated circuit

UNITED MICROELECTRONICS CORP22 citations92
US5429975AJul 4, 1995

Method of implanting during manufacture of ROM device

UNITED MICROELECTRONICS CORP25 citations92
US5413950AMay 9, 1995

Method of forming a DRAM stacked capacitor cell

UNITED MICROELECTRONICS CORP45 citations90
US5496776AMar 5, 1996

Spin-on-glass planarization process with ion implantation

UNITED MICROELECTRONICS CORP37 citations89
US5915201AJun 22, 1999

Trench surrounded metal pattern

UNITED MICROELECTRONICS CORP18 citations84
US5668031ASep 16, 1997

Method of fabricating high density flat cell mask ROM

UNITED MICROELECTRONICS CORP18 citations84
US5625213AApr 29, 1997

Top floating-gate flash EEPROM structure

UNITED MICROELECTRONICS CORP17 citations82
US5585656ADec 17, 1996

High coupling ratio of flash memory

UNITED MICROELECTRONICS CORP16 citations82
US5882970AMar 16, 1999

Method for fabricating flash memory cell having a decreased overlapped region between its source and gate

UNITED MICROELECTRONICS CORP15 citations74
US5858826AJan 12, 1999

Method of making a blanket N-well structure for SRAM data stability in P-type substrates

UNITED MICROELECTRONICS CORP13 citations74
US5750438AMay 12, 1998

Method for fabricating a local interconnection structure

UNITED MICROELECTRONICS CORP7 citations74
US5594684AJan 14, 1997

Polysilicon programming memory cell

UNITED MICROELECTRONICS CORP5 citations74
US5578857ANov 26, 1996

Double poly high density buried bit line mask ROM

UNITED MICROELECTRONICS CORP13 citations74

SILICON INTEGRATED SYS CORP

10 patents

SILICON INTERGRATED SYSTEMS CO

1 patent

POWERCHIP SEMICONDUCTOR CORP

1 patent

UNITED MICROELECTRONICS COPORA

1 patent

Showing the top 50 of 97 patents by PatentIndex Score.