Inventor
TAKENAKA MASASHI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “TAKENAKA MASASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
20 patentsUS6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US5920117AJul 6, 1999
Semiconductor device and method of forming the device
FUJITSU LTD135 citations98
US5726493AMar 10, 1998
Semiconductor device and semiconductor device unit having ball-grid-array type package structure
FUJITSU LTD516 citations98
US6347037B2Feb 12, 2002
Semiconductor device and method of forming the same
FUJITSU LTD99 citations97
US5831441ANov 3, 1998
Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device
FUJITSU LTD58 citations94
US7193320B2Mar 20, 2007
Semiconductor device having a heat spreader exposed from a seal resin
FUJITSU LTD24 citations92
US6184133B1Feb 6, 2001
Method of forming an assembly board with insulator filled through holes
FUJITSU LTD26 citations92
US5750421AMay 12, 1998
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD27 citations92
US5729435AMar 17, 1998
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD22 citations92
US5666064ASep 9, 1997
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD25 citations92
US5656864AAug 12, 1997
Semiconductor device having upper and lower package bodies and manufacturing method thereof
FUJITSU LTD75 citations92
US5475259ADec 12, 1995
Semiconductor device and carrier for carrying semiconductor device
FUJITSU LTD29 citations92
US5444025AAug 22, 1995
Process for encapsulating a semiconductor package having a heat sink using a jig
FUJITSU LTD39 citations92
US6268645B1Jul 31, 2001
Semiconductor device
FUJITSU LTD18 citations81
US6088233AJul 11, 2000
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73
US5978222ANov 2, 1999
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73
US5889333AMar 30, 1999
Semiconductor device and method for manufacturing such
FUJITSU LTD12 citations73
US5736428AApr 7, 1998
Process for manufacturing a semiconductor device having a stepped encapsulated package
FUJITSU LTD8 citations73
US5659200AAug 19, 1997
Semiconductor device having radiator structure
FUJITSU LTD11 citations73
US6342729B1Jan 29, 2002
Tape carrier package
FUJITSU LTD6 citations59