Inventor
WILSON JAMES WARREN
US22 patents
Patents
22 patentsUS6919514B2Jul 19, 2005
Structure having laser ablated features and method of fabricating
IBM157 citations98
US6730857B2May 4, 2004
Structure having laser ablated features and method of fabricating
IBM188 citations98
US5798563AAug 25, 1998
Polytetrafluoroethylene thin film chip carrier
IBM112 citations97
US6900545B1May 31, 2005
Variable thickness pads on a substrate surface
IBM48 citations95
US5939783AAug 17, 1999
Electronic package
IBM68 citations94
US5751060AMay 12, 1998
Electronic package
IBM43 citations94
US6077766AJun 20, 2000
Variable thickness pads on a substrate surface
IBM29 citations92
US6013417AJan 11, 2000
Process for fabricating circuitry on substrates having plated through-holes
IBM21 citations92
US5747877AMay 5, 1998
Semiconductor chip package with enhanced thermal conductivity
IBM27 citations92
US5661089AAug 26, 1997
Method for making a semiconductor chip package with enhanced thermal conductivity
IBM28 citations92
US6259037B1Jul 10, 2001
Polytetrafluoroethylene thin film chip carrier
IBM35 citations91
US6006428ADec 28, 1999
Polytetrafluoroethylene thin film chip carrier
IBM25 citations91
US5728606AMar 17, 1998
Electronic Package
IBM35 citations90
US6150716ANov 21, 2000
Metal substrate having an IC chip and carrier mounting
IBM30 citations88
US5768774AJun 23, 1998
Thermally enhanced ball grid array package
IBM19 citations87
US5966803AOct 19, 1999
Ball grid array having no through holes or via interconnections
IBM17 citations84
US6989297B2Jan 24, 2006
Variable thickness pads on a substrate surface
IBM8 citations73
US6739048B2May 25, 2004
Process of fabricating a circuitized structure
IBM12 citations73
US6131279AOct 17, 2000
Integrated manufacturing packaging process
IBM14 citations73
US6027858AFeb 22, 2000
Process for tenting PTH's with PID dry film
IBM11 citations70
US6455139B2Sep 24, 2002
Process for reducing extraneous metal plating
IBM0 citations51
US6296897B1Oct 2, 2001
Process for reducing extraneous metal plating
IBM1 citations51