Inventor
KIM JONGWAN
KR13 patents
⚠️ This page may combine multiple inventors who share the name “KIM JONGWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS11334457B1May 17, 2022
Semiconductor memory device and memory system including the same
SAMSUNG ELECTRONICS CO LTD3 citations67
US12205925B2Jan 21, 2025
Semiconductor package having package substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US12132007B2Oct 29, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11581266B2Feb 14, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12400970B2Aug 26, 2025
Semiconductor package including electromagnetic shield structure
SAMSUNG ELECTRONICS CO LTD0 citations58
US12494439B2Dec 9, 2025
Semiconductor packages having fixing members
SAMSUNG ELECTRONICS CO LTD0 citations50
US12456660B2Oct 28, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12057357B2Aug 6, 2024
Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses
SAMSUNG ELECTRONICS CO LTD0 citations48
US12550739B2Feb 10, 2026
Semiconductor package including a metal plate and package-on-package having the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12463126B2Nov 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
US12308253B2May 20, 2025
Molded product for semiconductor strip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
US10067584B2Sep 4, 2018
Films for writing and display apparatuses including the same
SAMSUNG ELECTRONICS CO LTD0 citations43