Inventor
PAPATHOMAS KOSTAS I
US29 patents
⚠️ This page may combine multiple inventors who share the name “PAPATHOMAS KOSTAS I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS4999699AMar 12, 1991
Solder interconnection structure and process for making
IBM137 citations97
US5656862AAug 12, 1997
Solder interconnection structure
IBM86 citations96
US5250848AOct 5, 1993
Solder interconnection structure
IBM61 citations96
US5089440AFeb 18, 1992
Solder interconnection structure and process for making
IBM62 citations96
US5668059ASep 16, 1997
Solder interconnection structure and process for making
IBM72 citations93
US6199751B1Mar 13, 2001
Polymer with transient liquid phase bondable particles
IBM32 citations92
US6114098ASep 5, 2000
Method of filling an aperture in a substrate
IBM25 citations92
US6087021AJul 11, 2000
Polymer with transient liquid phase bondable particles
IBM17 citations92
US6125531AOct 3, 2000
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
IBM16 citations91
US6079100AJun 27, 2000
Method of making a printed circuit board having filled holes and fill member for use therewith
IBM48 citations91
US5015719AMay 14, 1991
Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods
IBM10 citations74
US5471096ANov 28, 1995
Solder interconnection from a composition containing a mixture of dicyanates
IBM16 citations73
US5637442AJun 10, 1997
Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol
IBM14 citations71
US5310428AMay 10, 1994
Solvent stabilization process and method of recovering solvent
IBM10 citations71
US6609296B1Aug 26, 2003
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
IBM3 citations61
US5571417ANov 5, 1996
Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol
IBM2 citations60
ENDICOTT INTERCONNECT TECH INC
9 patentsUS7470990B2Dec 30, 2008
Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC16 citations92
US7348677B2Mar 25, 2008
Method of providing printed circuit board with conductive holes and board resulting therefrom
ENDICOTT INTERCONNECT TECH INC19 citations92
US7211289B2May 1, 2007
Method of making multilayered printed circuit board with filled conductive holes
ENDICOTT INTERCONNECT TECH INC21 citations92
US7646098B2Jan 12, 2010
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
ENDICOTT INTERCONNECT TECH INC9 citations84
US7541265B2Jun 2, 2009
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
ENDICOTT INTERCONNECT TECH INC12 citations84
US7416972B2Aug 26, 2008
Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
ENDICOTT INTERCONNECT TECH INC6 citations74
US7145221B2Dec 5, 2006
Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC10 citations74
US7429789B2Sep 30, 2008
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same
ENDICOTT INTERCONNECT TECH INC5 citations63
US7931830B2Apr 26, 2011
Dielectric composition for use in circuitized substrates and circuitized substrate including same
ENDICOTT INTERCONNECT TECH INC1 citations52