Inventor
COFER ALFERD
US17 patents
⚠️ This page may combine multiple inventors who share the name “COFER ALFERD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEGAL CORP
13 patentsUS6354240B1Mar 12, 2002
Plasma etch reactor having a plurality of magnets
TEGAL CORP57 citations95
US6190496B1Feb 20, 2001
Plasma etch reactor and method for emerging films
TEGAL CORP68 citations95
US6048435AApr 11, 2000
Plasma etch reactor and method for emerging films
TEGAL CORP58 citations95
US6620335B1Sep 16, 2003
Plasma etch reactor and method
TEGAL CORP23 citations92
US6410448B1Jun 25, 2002
Plasma etch reactor and method for emerging films
TEGAL CORP15 citations92
US6287975B1Sep 11, 2001
Method for using a hard mask for critical dimension growth containment
TEGAL CORP21 citations92
US6127277AOct 3, 2000
Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls
TEGAL CORP21 citations91
US6500314B1Dec 31, 2002
Plasma etch reactor and method
TEGAL CORP11 citations81
US6958295B1Oct 25, 2005
Method for using a hard mask for critical dimension growth containment
TEGAL CORP5 citations73
US6905969B2Jun 14, 2005
Plasma etch reactor and method
TEGAL CORP7 citations73
US6774046B2Aug 10, 2004
Method for minimizing the critical dimension growth of a feature on a semiconductor wafer
TEGAL CORP6 citations72
US6492280B1Dec 10, 2002
Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls
TEGAL CORP7 citations72
US7223699B2May 29, 2007
Plasma etch reactor and method
TEGAL CORP3 citations62
LAM RES CORP
3 patentsUS7459100B2Dec 2, 2008
Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate
LAM RES CORP40 citations91
US7351664B2Apr 1, 2008
Methods for minimizing mask undercuts and notches for plasma processing system
LAM RES CORP3 citations59
US7985688B2Jul 26, 2011
Notch stop pulsing process for plasma processing system
LAM RES CORP0 citations40