Inventor

BEVIS CHRISTOPHER F

US53 patents

⚠️ This page may combine multiple inventors who share the name “BEVIS CHRISTOPHER F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BEVIS CHRISTOPHER F

KLA TENCOR TECH CORP

Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout

Apparatus and methods for detecting overlay errors using scatterometry

Apparatus and methods for detecting overlay errors using scatterometry

Systems for inspection of patterned or unpatterned wafers and other specimen

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Apparatus and methods for detecting overlay errors using scatterometry

Apparatus and methods for detecting overlay errors using scatterometry

Apparatus and methods for detecting overlay errors using scatterometry

Systems and methods for characterizing a polishing process

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

Apparatus and methods for detecting overlay errors using scatterometry

Apparatus and methods for detecting overlay errors using scatterometry

Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools

Apparatus and methods for detecting overlay errors using scatterometry

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Darkfield inspection system having a programmable light selection array

Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device

Darkfield inspection system having photodetector array

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Darkfield inspection system having a programmable light selection array

Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing

Surface inspection system and method for using photo detector array to detect defects in inspection surface

Calibration standards and methods

Optical measurment systems and methods

Methods and systems for detecting a presence of blobs on a specimen during a polishing process

Methods and systems for optical and non-optical measurements of a substrate

Electrical test method and apparatus

Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique

Critical dimension scanning electron microscope

System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface

KLA TENCOR CORP

Design driven inspection or measurement for semiconductor using recipe

Scatterometry target employing non-periodic defect features to enhance or optimize target sensitivity to a parameter of interest

Systems and methods for near-field heterodyne spectroscopy

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

In plane drift compensation

Scatterometry target and method

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

TENCOR INSTRUMENTS

Surface scanner with thin film gauge

Thin film thickness monitor

KIRK MICHAEL D

Methods and systems for determining a characteristic of a wafer

Methods and systems for determining a characteristic of a wafer

NOVA MEASURING INSTR INC

Mass spectrometer detector and system and method using the same

Mass spectrometer detector and system and method using the same

KOJIMA SHINICHI

Apparatus and methods for electron beam detection

KLA TENCOR TECHNOLOGIES

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad

KLA TENCOR TECHNOLOGIES INC

Driven inspection or measurement

BEVIS CHRISTOPHER F

Apparatus and methods for aberration correction in electron beam based system

SCANIT TECH INC

Hyper-spectral imaging of airborne biological particles

LEHMAN KURT

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool