Inventor

YEUNG FAN

US4 patents

⚠️ This page may combine multiple inventors who share the name “YEUNG FAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ATI TECHNOLOGIES ULC

2 patents

US7670939B2Mar 2, 2010

Semiconductor chip bump connection apparatus and method

ATI TECHNOLOGIES ULC67 citations96

US8378471B2Feb 19, 2013

Semiconductor chip bump connection apparatus and method

ATI TECHNOLOGIES ULC1 citations50

YEUNG FAN

1 patent

US8779598B2Jul 15, 2014

Method and apparatuses for integrated circuit substrate manufacture

YEUNG FAN5 citations60

BROADCOM CORP

1 patent

US7646083B2Jan 12, 2010

I/O connection scheme for QFN leadframe and package structures

BROADCOM CORP4 citations60