Inventor
KUWAJIMA HAJIME
JP29 patents
⚠️ This page may combine multiple inventors who share the name “KUWAJIMA HAJIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
28 patentsUS6181015B1Jan 30, 2001
Face-down mounted surface acoustic wave device
TDK CORP115 citations97
US6417026B2Jul 9, 2002
Acoustic wave device face-down mounted on a substrate
TDK CORP73 citations96
US7855460B2Dec 21, 2010
Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the same
TDK CORP39 citations92
US7973246B2Jul 5, 2011
Electronic component
TDK CORP10 citations84
US7859080B2Dec 28, 2010
Electronic component comprising a coil conductor and a capacity element
TDK CORP17 citations84
US7652349B2Jan 26, 2010
Thin-film device and method of manufacturing same
TDK CORP8 citations84
US7321284B2Jan 22, 2008
Miniature thin-film bandpass filter
TDK CORP13 citations82
US9647626B2May 9, 2017
LC composite component
TDK CORP2 citations71
US9178264B2Nov 3, 2015
Directional coupler and wireless communication device
TDK CORP4 citations70
US8048228B2Nov 1, 2011
Masking apparatus and method of fabricating electronic component
TDK CORP6 citations63
US7905012B2Mar 15, 2011
Method for manufacturing electronic components
TDK CORP4 citations63
US7675136B2Mar 9, 2010
Thin-film device including a terminal electrode connected to respective end faces of conductor layers
TDK CORP2 citations63
US7667951B2Feb 23, 2010
Electronic component
TDK CORP2 citations63
US7649251B2Jan 19, 2010
Thin-film device
TDK CORP2 citations63
US7589416B2Sep 15, 2009
Substrate, electronic component, and manufacturing method of these
TDK CORP2 citations63
US11545303B2Jan 3, 2023
Electronic component and its manufacturing method
TDK CORP0 citations62
US11452209B2Sep 20, 2022
Electronic component and its manufacturing method
TDK CORP0 citations62
US7883614B2Feb 8, 2011
Method of manufacturing electronic part and electronic part
TDK CORP1 citations52
US7371682B2May 13, 2008
Production method for electronic component and electronic component
TDK CORP1 citations52
US11967469B2Apr 23, 2024
Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same
TDK CORP0 citations51
US7683740B2Mar 23, 2010
Electronic component and method for manufacturing same
TDK CORP0 citations50
US9300027B2Mar 29, 2016
Directional coupler
TDK CORP1 citations49
US7608881B2Oct 27, 2009
Thin-film device and method of manufacturing same
TDK CORP0 citations42
US7586048B2Sep 8, 2009
Electronic component
TDK CORP0 citations42
US7563342B2Jul 21, 2009
Method of manufacturing laminated substrate
TDK CORP0 citations42
US7489036B2Feb 10, 2009
Thin-film device
TDK CORP0 citations42
US7987590B2Aug 2, 2011
Method for manufacturing an electronic part
TDK CORP0 citations41
US10426032B1Sep 24, 2019
Multilayer wiring structure and its manufacturing method
TDK CORP0 citations40