Inventor
NIIMI AKIHIRO
JP6 patents
⚠️ This page may combine multiple inventors who share the name “NIIMI AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
5 patentsUS7009292B2Mar 7, 2006
Package type semiconductor device
DENSO CORP16 citations83
US7193326B2Mar 20, 2007
Mold type semiconductor device
DENSO CORP3 citations62
US7910460B2Mar 22, 2011
Metallic electrode forming method and semiconductor device having metallic electrode
DENSO CORP2 citations59
US7468318B2Dec 23, 2008
Method for manufacturing mold type semiconductor device
DENSO CORP0 citations51
US7800232B2Sep 21, 2010
Metallic electrode forming method and semiconductor device having metallic electrode
DENSO CORP0 citations48