Inventor

REDEKER FRED C

US170 patents

⚠️ This page may combine multiple inventors who share the name “REDEKER FRED C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REDEKER FRED C

APPLIED MATERIALS INC

Method and apparatus for enhanced CMP using metals having reductive properties

Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling

Method and apparatus for electrochemical-mechanical planarization

High density plasma CVD reactor with combined inductive and capacitive coupling

In-situ monitoring of linear substrate polishing operations

Deposition chamber and method for depositing low dielectric constant films

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Plasma source for HDP-CVD chamber

High density plasma CVD reactor with combined inductive and capacitive coupling

Apparatus and method for cleaning of semiconductor process chamber surfaces

Deposition chamber for improved deposition thickness uniformity

Method and apparatus for electrochemical-mechanical planarization

Chemical mechanical polishing of a metal layer with polishing rate monitoring

Semiconductor substrate cleaning system

Additives to CMP slurry to polish dielectric films

Endpoint monitoring with polishing rate change

Symmetric tunable inductively coupled HDP-CVD reactor

Substrate support with pressure zones having reduced contact area and temperature feedback

CMP pad construction with composite material properties using additive manufacturing processes

Inductively coupled HDP-CVD reactor

Multi-zone RF inductively coupled source configuration

Deposition chamber and method for depositing low dielectric constant films

Linear polishing sheet with window

Polishing pad having a grooved pattern for use in chemical mechanical polishing

Deposition chamber and method for depositing low dielectric constant films

In-situ monitoring of linear substrate polishing operations

Method and apparatus for enhanced CMP using metals having reductive properties

Wafer edge cleaning method and apparatus

Deposition chamber and method for depositing low dielectric constant films

Plasma source for HDP-CVD chamber

Shield for an electrostatic chuck

Chemical mechanical polishing processes and components

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

CMP platen with patterned surface

Plasma etching apparatus with conductive means for inhibiting arcing

CMP pad construction with composite material properties using additive manufacturing processes

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Porous chemical mechanical polishing pads

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Polishing pads produced by an additive manufacturing process

Cu CMP polishing pad cleaning

Linear polishing sheet with window

Selective removal of tantalum-containing barrier layer during metal CMP

Additives for pressure sensitive polishing compositions

LAM RES CORP

Methods and systems for processing a substrate using a dynamic liquid meniscus

Apparatus and method for providing a confined liquid for immersion lithography

Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid

Vertical proximity processor

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition