Inventor

BOYD JOHN M

US96 patents

⚠️ This page may combine multiple inventors who share the name “BOYD JOHN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOYD JOHN M

LAM RES CORP

Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid

Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection

Field controlled polishing apparatus and method

Field controlled polishing apparatus

Method and apparatus for conditioning a polishing pad

Electroless plating method and apparatus

Apparatus for oscillating a head and methods for implementing the same

Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection

Wafer bevel edge cleaning system and apparatus

Method for controlling galvanic corrosion effects on a single-wafer cleaning system

System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques

Optical view port for chemical mechanical planarization endpoint detection

Sacrificial retaining ring CMP system and methods for implementing the same

Apparatus and method for qualifying a chemical mechanical planarization process

Interconnect structure and method of manufacturing a damascene structure

Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same

Method and system to separate and recycle divergent chemistries

Wafer edge surface treatment with liquid meniscus

System and method for integrating in-situ metrology within a wafer process

Method and apparatus for simultaneously cleaning the front side and back side of a wafer

Method and apparatus to decouple power and cavitation for megasonic cleaning applications

Compliant wafer chuck

Method and apparatus for megasonic cleaning with reflected acoustic waves

System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques

In-situ local heating using megasonic transducer resonator

Method and apparatus for cooling a resonator of a megasonic transducer

Enhanced wafer cleaning method

Subaperture chemical mechanical polishing system

Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette

Active gimbal ring with internal gel and methods for making same

Apparatus and method for integrated surface treatment and deposition for copper interconnect

Method and apparatus for cleaning a substrate using megasonic power

Compliant grinding wheel

Methods of and apparatus for pre-planarizing a substrate

Method and apparatus for conditioning a polishing pad

NORTHERN TELECOM LTD

Method of making integrated circuits

Buried layer contact for an integrated circuit structure

Method of forming a transistor

Trench resistors for integrated circuits

Forming resistors for intergrated circuits

Trench capacitor structure

Method of forming electrodes for trench capacitors

Integrated circuit structure and method of fabrication thereof

Method for forming integrated circuit structure

STRASBAUGH

Subaperture chemical mechanical planarization with polishing pad conditioning

Subaperture chemical mechanical planarization with polishing pad conditioning

STRASBAUGH INC

Optical view port for chemical mechanical planarization endpoint detection

GTE PROD CORP

Protective circuit for reduced voltage lamps

YOON HYUNGSUK ALEXANDER

Apparatus and method for atomic layer deposition

THIE WILLIAM

Simultaneous electroless plating of two substrates