Inventor

DORDI YEZDI

US85 patents

⚠️ This page may combine multiple inventors who share the name “DORDI YEZDI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DORDI YEZDI

LAM RES CORP

Methods of post-contact back end of the line through-hole via integration

Electroless plating method and apparatus

Plating solutions for electroless deposition of copper

Interconnect structure and method of manufacturing a damascene structure

Apparatus for the removal of a metal oxide from a substrate and methods therefor

Process integration scheme to lower overall dielectric constant in BEoL interconnect structures

Compliant wafer chuck

Interlevel conductor pre-fill utilizing selective barrier deposition

Self-forming barrier process

Interlevel conductor pre-fill utilizing selective barrier deposition

Electroless deposition of continuous platinum layer

Apparatus and method for integrated surface treatment and deposition for copper interconnect

Compliant grinding wheel

Methods of and apparatus for pre-planarizing a substrate

Electroplating head and method for operating the same

Self-forming barrier process

Interlevel conductor pre-fill utilizing selective barrier deposition

Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment

Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents

Apparatus for applying a plating solution for electroless deposition

Methods and systems for low interfacial oxide contact between barrier and copper metallization

Apparatus and method for confined area planarization

Semiconductor wafer material removal apparatus and method for operating the same

APPLIED MATERIALS INC

In-situ electroless copper seed layer enhancement in an electroplating system

Method for achieving copper fill of high aspect ratio interconnect features

Electro-chemical deposition system

Method of treating a substrate

Electro-chemical deposition cell for face-up processing of single semiconductor substrates

Electro-chemical deposition system

Electro-chemical deposition system and method

Electro-chemical deposition system

Dynamic pulse plating for high aspect ratio features

Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer

Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits

Electro-chemical deposition system

Electrochemical processing cell

Electro-chemical deposition cell for face-up processing of single semiconductor substrates

Method and apparatus for annealing copper films

Method of conditioning electrochemical baths in plating technology

YOON HYUNGSUK ALEXANDER

Method for barrier interface preparation of copper interconnect

Methods for removing a metal oxide from a substrate

Apparatus and method for atomic layer deposition

Methods for atomic layer deposition

DORDI YEZDI

Processes and systems for engineering a copper surface for selective metal deposition

Processes and systems for engineering a barrier surface for copper deposition

Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide

BOYD JOHN

Controlled ambient system for interface engineering

Methods and apparatuses for three dimensional integrated circuits

Device with post-contact back end of line through-hole via integration

THIE WILLIAM

Simultaneous electroless plating of two substrates