Inventor

TSUCHIKAWA SHINJI

JP15 patents

⚠️ This page may combine multiple inventors who share the name “TSUCHIKAWA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

10 patents

US6667107B2Dec 23, 2003

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

HITACHI CHEMICAL CO LTD1 citations62

US11581212B2Feb 14, 2023

Prepreg for coreless substrate, coreless substrate and semiconductor package

HITACHI CHEMICAL CO LTD0 citations60

US10119047B2Nov 6, 2018

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

HITACHI CHEMICAL CO LTD1 citations51

US7078106B2Jul 18, 2006

Thermosetting resin composition and use thereof

HITACHI CHEMICAL CO LTD1 citations51

US10681807B2Jun 9, 2020

Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

HITACHI CHEMICAL CO LTD0 citations50

US11214660B2Jan 4, 2022

Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

HITACHI CHEMICAL CO LTD0 citations49

US10604641B2Mar 31, 2020

Thermosetting resin composition and prepreg and laminate both made with the same

HITACHI CHEMICAL CO LTD0 citations40

TSUCHIKAWA SHINJI

3 patents

US9603244B2Mar 21, 2017

Thermosetting resin composition and prepreg and laminate obtained with the same

TSUCHIKAWA SHINJI2 citations69

US8796473B2Aug 5, 2014

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

TSUCHIKAWA SHINJI0 citations48

US8461332B2Jun 11, 2013

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

TSUCHIKAWA SHINJI0 citations48

KOTAKE TOMOHIKO

1 patent

US9079376B2Jul 14, 2015

Prepreg, laminate obtained with the same and printed-wiring board

KOTAKE TOMOHIKO1 citations46

RESONAC CORP

1 patent

US12168709B2Dec 17, 2024

Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module

RESONAC CORP0 citations45

TSUCHIKAWA SHINJI

HITACHI CHEMICAL CO LTD

Thermosetting resin composition and use thereof

Thermosetting resin composition, and prepreg and laminated board using the same

Process for preparing printed circuit board

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Prepreg for coreless substrate, coreless substrate and semiconductor package

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Thermosetting resin composition and use thereof

Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

Thermosetting resin composition and prepreg and laminate both made with the same

TSUCHIKAWA SHINJI

Thermosetting resin composition and prepreg and laminate obtained with the same

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

KOTAKE TOMOHIKO

Prepreg, laminate obtained with the same and printed-wiring board

RESONAC CORP

Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module