Inventor

CHUNG HYUN-SOO

KR61 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG HYUN-SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG HYUN-SOO

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Wafer level package having a stress relief spacer and manufacturing method thereof

Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad

Semiconductor packages

Semiconductor package

Method of manufacturing semiconductor package

Semiconductor device having through electrode and method of fabricating the same

Stack-type semiconductor device having cooling path on its bottom surface

Wafer level package having redistribution interconnection layer and method of forming the same

Wafer level chip scale package having a gap and method for manufacturing the same

Board on chip package and method of manufacturing the same

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Wafer level package having a stress relief spacer and manufacturing method thereof

Wafer level chip scale package having a gap and method for manufacturing the same

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Wafer-level stack package and method of fabricating the same

Wafer level package and method of fabricating the same

Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad

Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad

Semiconductor packages

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

Semiconductor package having pads with stepped structure

Semiconductor package having pads with stepped structure

Semiconductor package having pads with stepped structure

Semiconductor chip including a bump structure and semiconductor package including the same

Chip stack package and method of fabricating the same

Board on chip package and method of manufacturing the same

CHUNG HYUN-SOO

Wafer level package having a stress relief spacer and manufacturing method thereof

Semiconductor packages and methods of manufacturing the same

Wafer level package having a stress relief spacer and manufacturing method thereof

Wafer level package having a stress relief spacer and manufacturing method thereof

Wafer level semiconductor module and method for manufacturing the same

Bottle cap

IRE CHEMICAL LTD

Copolyester resin composition and a process of preparation thereof

Golf tee

Copolyester resin composition and a process of preparation thereof

Polyester resin and a process for preparing the same

LEE HO-JIN

Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices

Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes

LG DISPLAY CO LTD

Lamp with sound

Lamp with sound organic light emitting diode (OLED) coupled thereto

LX SEMICON CO LTD

Touch sensing circuit and its method for sensing multi-frequency signals

Touch circuit and touch sensing method

SILICON WORKS CO LTD

Touch sensing device and display apparatus including the same

BAEK SEUNG-DUK

Semiconductor device including redistribution line structure and method of fabricating the same

KIM KI-HYUK

Semiconductor devices having redistribution structures and packages, and methods of forming the same

PARK MYEONG-SOON

Semiconductor package and multi-chip package using the same

SHIN CHANG-WOO

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same