Inventor

HWANG SON-KWAN

KR18 patents

⚠️ This page may combine multiple inventors who share the name “HWANG SON-KWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG SON-KWAN

SAMSUNG ELECTRONICS CO LTD

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby

Semiconductor device having through electrode and method of fabricating the same

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Wafer-level stack package and method of fabricating the same

Wafer level package and method of fabricating the same

Integrated circuit device including through-silicon via structure and method of manufacturing the same

Chip stack package and method of fabricating the same

Semiconductor device and method for fabricating the same

LEE HO-JIN

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Integrated circuit chips having vertically extended through-substrate vias therein

Methods of forming integrated circuit chips having vertically extended through-substrate vias therein

HWANG SON-KWAN

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

MA KEUM-HEE

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

CHOI JU IL

Integrated circuit device including through-silicon via structure and method of manufacturing the same

CHOI JU-IL

Semiconductor device having through silicon via (TSV)

LEE IN-YOUNG

Wafer-level stack package and method of fabricating the same