Inventor

IWASHITA MITSUAKI

JP57 patents

⚠️ This page may combine multiple inventors who share the name “IWASHITA MITSUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IWASHITA MITSUAKI

TOKYO ELECTRON LTD

Polishing system

Method and apparatus for polishing

Film forming method by radiating a plasma on a surface of a low dielectric constant film

Film forming method and film forming apparatus

Film-forming apparatus

Apparatus for plating process

Patterning method

Polishing apparatus, polishing member

Polishing system and polishing method

Plating method and recording medium

Supercritical drying method for semiconductor substrate and supercritical drying apparatus

Methods for forming vertically layered ionic liquid crystal (ILC) structures on a semiconductor substrate

Micro pattern forming method

Patterning method utilizing SiBN and photolithography

Substrate liquid processing apparatus and substrate liquid processing method

Electrocaloric effect element, heat transfer device, semiconductor manufacturing device, and electrocaloric effect element control method

Method for manufacturing a contact pad, method for manufacturing a semiconductor device using same, and semiconductor device

Forming method of hard mask

Thin film processing method and system

Substrate processing method and substrate processing system

Substrate processing method and ionic liquid

Substrate processing apparatus and substrate processing method

Plating method, recording medium and plating system

Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium

Plating apparatus, plating method, and storage medium

Semiconductor manufacturing apparatus and semiconductor manufacturing method

Forming method of hard mask, forming apparatus of hard mask and recording medium

Catalyst layer forming method, catalyst layer forming system and recording medium

Pre-treatment method of plating, storage medium, and plating system

Pre-treatment method for plating and storage medium

Substrate treatment method for etching a base film using a resist pattern

Vacuum processing apparatus and oxidizing gas removal method

Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure

Plating apparatus, plating method and storage medium

Plating method, plating apparatus, and storage medium

Plating method, plating system and storage medium

TANAKA TAKASHI

Plating apparatus, plating method and storage medium

Liquid treatment apparatus and liquid treatment method

Substrate processing method and substrate processing apparatus

Cap metal forming method

Plating apparatus, plating method and storage medium having plating program stored thereon

INATOMI YUICHIRO

Plating apparatus, plating method and storage medium

Developing treatment method

JI LINAN

Supercritical drying method for semiconductor substrate and supercritical drying apparatus

NAKAJIMA SHIGERU

Patterning method

TOSHIMA TAKAYUKI

Supercritical processing apparatus and supercritical processing method

TOSHIBA KK

Supercritical drying method and apparatus for semiconductor substrates

HAYASHI HIDEKAZU

Substrate processing method, substrate processing apparatus, and storage medium

HARA KENICHI

Semiconductor manufacturing apparatus and semiconductor manufacturing method

MITSUOKA KAZUYUKI

Pattern forming method and method of manufacturing semiconductor device by using the same