Inventor
MIZUTANI NOBUTAKA
JP20 patents
⚠️ This page may combine multiple inventors who share the name “MIZUTANI NOBUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
18 patentsUS10224208B2Mar 5, 2019
Plating method and recording medium
TOKYO ELECTRON LTD2 citations73
US10731256B2Aug 4, 2020
Plating apparatus, plating method, and recording medium
TOKYO ELECTRON LTD2 citations72
US11004684B2May 11, 2021
Forming method of hard mask
TOKYO ELECTRON LTD0 citations62
US11519074B2Dec 6, 2022
Plating method and recording medium
TOKYO ELECTRON LTD0 citations61
US7176142B2Feb 13, 2007
Method of manufacturing trench structure for device
TOKYO ELECTRON LTD2 citations61
US9711363B2Jul 18, 2017
Plating method, recording medium and plating system
TOKYO ELECTRON LTD1 citations52
US9653354B2May 16, 2017
Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
TOKYO ELECTRON LTD0 citations52
US9552994B2Jan 24, 2017
Plating apparatus, plating method, and storage medium
TOKYO ELECTRON LTD0 citations52
US10224202B2Mar 5, 2019
Forming method of hard mask, forming apparatus of hard mask and recording medium
TOKYO ELECTRON LTD0 citations51
US9966306B2May 8, 2018
Catalyst layer forming method, catalyst layer forming system and recording medium
TOKYO ELECTRON LTD1 citations51
US9650717B2May 16, 2017
Pre-treatment method of plating, storage medium, and plating system
TOKYO ELECTRON LTD0 citations51
US10755973B2Aug 25, 2020
Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
TOKYO ELECTRON LTD0 citations49
US9888585B2Feb 6, 2018
Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure
TOKYO ELECTRON LTD0 citations47
US10179950B2Jan 15, 2019
Plating method, plated component, and plating system
TOKYO ELECTRON LTD0 citations41
US10138556B2Nov 27, 2018
Plating method, plating apparatus, and storage medium
TOKYO ELECTRON LTD0 citations41
US10030308B2Jul 24, 2018
Plating method, plating system and storage medium
TOKYO ELECTRON LTD0 citations41
US9837308B2Dec 5, 2017
Plating method, plating system and storage medium
TOKYO ELECTRON LTD0 citations41
US9653350B2May 16, 2017
Pre-treatment method for plating and storage medium
TOKYO ELECTRON LTD0 citations41