Inventor
DANI ASHAY
US9 patents
⚠️ This page may combine multiple inventors who share the name “DANI ASHAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS6926955B2Aug 9, 2005
Phase change material containing fusible particles as thermally conductive filler
INTEL CORP45 citations96
US7846778B2Dec 7, 2010
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
INTEL CORP24 citations92
US7473995B2Jan 6, 2009
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
INTEL CORP39 citations92
US7294394B2Nov 13, 2007
Phase change material containing fusible particles as thermally conductive filler
INTEL CORP18 citations92
US7252877B2Aug 7, 2007
Polymer matrices for polymer solder hybrid materials
INTEL CORP18 citations92
US7960019B2Jun 14, 2011
Phase change material containing fusible particles as thermally conductive filler
INTEL CORP19 citations88
US9247686B2Jan 26, 2016
Polymer matrices for polymer solder hybrid materials
INTEL CORP1 citations62
US7967942B2Jun 28, 2011
Polymer matrices for polymer solder hybrid materials
INTEL CORP2 citations62