Inventor
SUNG MIN-GYU
KR191 patents
⚠️ This page may combine multiple inventors who share the name “SUNG MIN-GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
47 patentsUS9947804B1Apr 17, 2018
Methods of forming nanosheet transistor with dielectric isolation of source-drain regions and related structure
GLOBALFOUNDRIES INC154 citations99
US9412616B1Aug 9, 2016
Methods of forming single and double diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products
GLOBALFOUNDRIES INC148 citations99
US10170484B1Jan 1, 2019
Integrated circuit structure incorporating multiple gate-all-around field effect transistors having different drive currents and method
GLOBALFOUNDRIES INC61 citations98
US10103238B1Oct 16, 2018
Nanosheet field-effect transistor with full dielectric isolation
GLOBALFOUNDRIES INC57 citations98
US9847390B1Dec 19, 2017
Self-aligned wrap-around contacts for nanosheet devices
GLOBALFOUNDRIES INC74 citations98
US9780208B1Oct 3, 2017
Method and structure of forming self-aligned RMG gate for VFET
GLOBALFOUNDRIES INC60 citations98
US9362181B1Jun 7, 2016
Methods of forming diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products
GLOBALFOUNDRIES INC69 citations98
US10217846B1Feb 26, 2019
Vertical field effect transistor formation with critical dimension control
GLOBALFOUNDRIES INC21 citations94
US9911619B1Mar 6, 2018
Fin cut with alternating two color fin hardmask
GLOBALFOUNDRIES INC24 citations94
US9899321B1Feb 20, 2018
Methods of forming a gate contact for a semiconductor device above the active region
GLOBALFOUNDRIES INC26 citations94
US9865704B2Jan 9, 2018
Single and double diffusion breaks on integrated circuit products comprised of FinFET devices
GLOBALFOUNDRIES INC41 citations94
US9818836B1Nov 14, 2017
Gate cut method for replacement metal gate integration
GLOBALFOUNDRIES INC24 citations94
US9799748B1Oct 24, 2017
Method of forming inner spacers on a nano-sheet/wire device
GLOBALFOUNDRIES INC33 citations94
US9780197B1Oct 3, 2017
Method of controlling VFET channel length
GLOBALFOUNDRIES INC30 citations94
US9761495B1Sep 12, 2017
Methods of performing concurrent fin and gate cut etch processes for FinFET semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC24 citations94
US9691664B1Jun 27, 2017
Dual thick EG oxide integration under aggressive SG fin pitch
GLOBALFOUNDRIES INC22 citations94
US9508604B1Nov 29, 2016
Methods of forming punch through stop regions on FinFET devices on CMOS-based IC products using doped spacers
GLOBALFOUNDRIES INC51 citations94
US9379017B1Jun 28, 2016
Method of forming a semiconductor structure including a plurality of fins and an alignment/overlay mark
GLOBALFOUNDRIES INC32 citations94
US9337101B1May 10, 2016
Methods for selectively removing a fin when forming FinFET devices
GLOBALFOUNDRIES INC25 citations94
US9735242B2Aug 15, 2017
Semiconductor device with a gate contact positioned above the active region
GLOBALFOUNDRIES INC17 citations93
US9312183B1Apr 12, 2016
Methods for forming FinFETS having a capping layer for reducing punch through leakage
GLOBALFOUNDRIES INC19 citations93
US9190488B1Nov 17, 2015
Methods of forming gate structure of semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC21 citations93
US9385189B1Jul 5, 2016
Fin liner integration under aggressive pitch
GLOBALFOUNDRIES INC29 citations91
US10410933B2Sep 10, 2019
Replacement metal gate patterning for nanosheet devices
GLOBALFOUNDRIES INC17 citations86
US10366930B1Jul 30, 2019
Self-aligned gate cut isolation
GLOBALFOUNDRIES INC15 citations86
US9991131B1Jun 5, 2018
Dual mandrels to enable variable fin pitch
GLOBALFOUNDRIES INC18 citations86
US10319627B2Jun 11, 2019
Air-gap spacers for field-effect transistors
GLOBALFOUNDRIES INC7 citations84
US10177041B2Jan 8, 2019
Fin-type field effect transistors (FINFETS) with replacement metal gates and methods
GLOBALFOUNDRIES INC11 citations84
US10177241B2Jan 8, 2019
Methods of forming a gate contact for a transistor above the active region and an air gap adjacent the gate of the transistor
GLOBALFOUNDRIES INC7 citations84
US10121702B1Nov 6, 2018
Methods, apparatus and system for forming source/drain contacts using early trench silicide cut
GLOBALFOUNDRIES INC13 citations84
US10084053B1Sep 25, 2018
Gate cuts after metal gate formation
GLOBALFOUNDRIES INC8 citations84
US10038065B2Jul 31, 2018
Method of forming a semiconductor device with a gate contact positioned above the active region
GLOBALFOUNDRIES INC10 citations84
US10014389B2Jul 3, 2018
Methods of forming IC products comprising a nano-sheet device and a transistor device having first and second replacement gate structures
GLOBALFOUNDRIES INC10 citations84
US10014297B1Jul 3, 2018
Methods of forming integrated circuit structure using extreme ultraviolet photolithography technique and related integrated circuit structure
GLOBALFOUNDRIES INC9 citations84
US10008577B2Jun 26, 2018
Methods of forming an air-gap spacer on a semiconductor device and the resulting device
GLOBALFOUNDRIES INC7 citations84
US9966456B1May 8, 2018
Methods of forming gate electrodes on a vertical transistor device
GLOBALFOUNDRIES INC14 citations84
US9779960B2Oct 3, 2017
Hybrid fin cutting processes for FinFET semiconductor devices
GLOBALFOUNDRIES INC9 citations84
US9741623B2Aug 22, 2017
Dual liner CMOS integration methods for FinFET devices
GLOBALFOUNDRIES INC7 citations84
US9735060B1Aug 15, 2017
Hybrid fin cut etching processes for products comprising tapered and non-tapered FinFET semiconductor devices
GLOBALFOUNDRIES INC7 citations84
US9722053B1Aug 1, 2017
Methods, apparatus and system for local isolation formation for finFET devices
GLOBALFOUNDRIES INC6 citations84
US9722024B1Aug 1, 2017
Formation of semiconductor structures employing selective removal of fins
GLOBALFOUNDRIES INC12 citations84
US9653356B2May 16, 2017
Methods of forming self-aligned device level contact structures
GLOBALFOUNDRIES INC8 citations84
US9595583B2Mar 14, 2017
Methods for forming FinFETS having a capping layer for reducing punch through leakage
GLOBALFOUNDRIES INC8 citations84
US9502286B2Nov 22, 2016
Methods of forming self-aligned contact structures on semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC14 citations84
US9502308B1Nov 22, 2016
Methods for forming transistor devices with different source/drain contact liners and the resulting devices
GLOBALFOUNDRIES INC10 citations84
US9478538B1Oct 25, 2016
Methods for forming transistor devices with different threshold voltages and the resulting devices
GLOBALFOUNDRIES INC7 citations84
US9449881B1Sep 20, 2016
Methods of forming fins for FinFET semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC7 citations84
IBM
1 patentHYNIX SEMICONDUCTOR INC
1 patentVARIAN SEMICONDUCTOR EQUIPMENT ASS INC
1 patentShowing the top 50 of 191 patents by PatentIndex Score.