Inventor
AKAMATSU KAORI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “AKAMATSU KAORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
10 patentsUS7205615B2Apr 17, 2007
Semiconductor device having internal stress film
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD53 citations96
US6051860AApr 18, 2000
Nonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD50 citations96
US6380585B1Apr 30, 2002
Nonvolatile semiconductor device capable of increased electron injection efficiency
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD37 citations93
US6358799B2Mar 19, 2002
Nonvolatile semiconductor memory device and method for fabricating the same, and semiconductor integrated circuit device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations93
US6184553B1Feb 6, 2001
Nonvolatile semiconductor memory device and method for fabricating the same, and semiconductor integrated circuit device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations93
US6147379ANov 14, 2000
Semiconductor device and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations93
US6121655ASep 19, 2000
Nonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations93
US7417289B2Aug 26, 2008
Semiconductor device having internal stress film
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations92
US6312981B1Nov 6, 2001
Method for manufacturing semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6251718B1Jun 26, 2001
Method for manufacturing semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations74
NITTO DENKO CORP
7 patentsUS11964462B2Apr 23, 2024
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP1 citations70
US12441083B2Oct 14, 2025
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP0 citations60
US11623429B2Apr 11, 2023
Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
NITTO DENKO CORP0 citations60
US12104100B2Oct 1, 2024
Adhesive composition, adhesive sheet, and adhered body
NITTO DENKO CORP0 citations57
US11279855B2Mar 22, 2022
Electrically peelable adhesive composition, adhesive sheet, and joined body
NITTO DENKO CORP1 citations57
US12037522B2Jul 16, 2024
Electrical debonding type adhesive sheet, joined body, and debonding method for joined body
NITTO DENKO CORP0 citations49
US11236256B2Feb 1, 2022
Double-sided adhesive sheet, joined body comprising double-sided adhesive sheet, and method for joining/separating adherends
NITTO DENKO CORP0 citations49
JOLED INC
3 patentsUS10756308B2Aug 25, 2020
Organic electroluminescence element and method of manufacturing the same
JOLED INC0 citations52
US10008698B2Jun 26, 2018
Organic electroluminescence element and method of manufacturing the same
JOLED INC0 citations52
US9184406B2Nov 10, 2015
Method of manufacturing an organic light-emitting element, organic light-emitting element, display panel, and display device
JOLED INC0 citations51