Inventor
KIM Hyeon-hyang
KR3 patents
Patents
3 patentsUS10068832B2Sep 4, 2018
EMI shielding structure having heat dissipation unit and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD9 citations79
US10566293B2Feb 18, 2020
Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
SAMSUNG ELECTRONICS CO LTD4 citations71
US10913201B2Feb 9, 2021
Object forming apparatus and controlling method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50