P

Inventor

ESPALIN DAVID

US15 patents
⚠️ This page may combine multiple inventors who share the name “ESPALIN DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV TEXAS

14 patents
US9777380B2Oct 3, 2017

Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas

UNIV TEXAS10 citations83
US10518490B2Dec 31, 2019

Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices

UNIV TEXAS9 citations82
US9414501B2Aug 9, 2016

Method for connecting inter-layer conductors and components in 3D structures

UNIV TEXAS15 citations82
US10913202B2Feb 9, 2021

Structurally integrating metal objects into additive manufactured structures

UNIV TEXAS3 citations72
US10259081B2Apr 16, 2019

Connecting metal foils/wires and components in 3D printed substrates with wire bonding

UNIV TEXAS3 citations72
US10691095B2Jun 23, 2020

In-situ diagnostics and control method and system for material extrusion 3D printing

UNIV TEXAS2 citations69
US10974499B2Apr 13, 2021

Metal objects spanning internal cavities in structures fabricated by additive manufacturing

UNIV TEXAS0 citations62
US10464306B2Nov 5, 2019

Metal objects spanning internal cavities in structures fabricated by additive manufacturing

UNIV TEXAS1 citations62
US11260475B2Mar 1, 2022

Method and system for powder bed fusion additive manufacturing of crack-free aluminum alloys

UNIV TEXAS2 citations61
US10569464B2Feb 25, 2020

Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning

UNIV TEXAS1 citations57
US11317515B2Apr 26, 2022

Wire embedding system with a curved delivery path

UNIV TEXAS1 citations56
US10660214B2May 19, 2020

Methods for connecting inter-layer conductors and components in 3D structures

UNIV TEXAS0 citations50
US11203165B2Dec 21, 2021

Methods and apparatus for embedding a wire intermittently

UNIV TEXAS0 citations47
US10582619B2Mar 3, 2020

Apparatus for wire handling and embedding on and within 3D printed parts

UNIV TEXAS0 citations34

WICKER RYAN B

1 patent