Inventor
MUKAIYAMA YOSHITAKA
JP16 patents
⚠️ This page may combine multiple inventors who share the name “MUKAIYAMA YOSHITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
14 patentsUS7022211B2Apr 4, 2006
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP47 citations95
US7402227B2Jul 22, 2008
Plating apparatus and method
EBARA CORP34 citations91
US7833393B2Nov 16, 2010
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP11 citations83
US9714476B2Jul 25, 2017
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
EBARA CORP2 citations72
US6500317B1Dec 31, 2002
Plating apparatus for detecting the conductivity between plating contacts on a substrate
EBARA CORP8 citations72
US12226825B2Feb 18, 2025
Buffer chamber and AM system including a buffer chamber
EBARA CORP0 citations62
US11891715B2Feb 6, 2024
Paddle, processing apparatus having the paddle, and method of producing the paddle
EBARA CORP0 citations62
US11047063B2Jun 29, 2021
Plating apparatus and plating method
EBARA CORP0 citations62
US11015261B2May 25, 2021
Substrate holder and plating apparatus
EBARA CORP0 citations61
US8012332B2Sep 6, 2011
Plating apparatus and method
EBARA CORP4 citations61
US11384447B2Jul 12, 2022
Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate
EBARA CORP0 citations51
US10294578B2May 21, 2019
Plating apparatus and plating method
EBARA CORP0 citations51
US10665495B2May 26, 2020
Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device
EBARA CORP0 citations41
US10577714B2Mar 3, 2020
Plating apparatus and plating method
EBARA CORP0 citations38