Inventor
GOMEZ FREDERICK RAY
PH7 patents
Patents
7 patentsUS10388594B2Aug 20, 2019
Protection from ESD during the manufacturing process of semiconductor chips
ST MICROELECTRONICS INC10 citations79
US9258890B2Feb 9, 2016
Support structure for stacked integrated circuit dies
ST MICROELECTRONICS INC8 citations77
US12094725B2Sep 17, 2024
Leadframe package with pre-applied filler material
ST MICROELECTRONICS INC0 citations60
US11227776B2Jan 18, 2022
Leadframe package with pre-applied filler material
ST MICROELECTRONICS INC0 citations60
US9578744B2Feb 21, 2017
Leadframe package with pre-applied filler material
ST MICROELECTRONICS INC1 citations60
US10672689B2Jun 2, 2020
Protection from ESD during the manufacturing process of semiconductor chips
ST MICROELECTRONICS INC1 citations58
US12211774B2Jan 28, 2025
Lead stabilization in semiconductor packages
ST MICROELECTRONICS INC0 citations50