Inventor
HSIEH CHENG-YEN
TW5 patents
Patents
5 patentsUS10867892B1Dec 15, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations83
US11545438B2Jan 3, 2023
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations82
US12374599B2Jul 29, 2025
Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11915994B2Feb 27, 2024
Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12431435B2Sep 30, 2025
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59