Inventor

HUANG PING-KANG

TW23 patents

⚠️ This page may combine multiple inventors who share the name “HUANG PING-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG PING-KANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Packages with interposers and methods for forming the same

Giga interposer integration through chip-on-wafer-on-substrate

Board substrates, three-dimensional integrated circuit structures and methods of forming the same

3D packages and methods for forming the same

Semiconductor device and manufacturing method thereof

Semiconductor packages and methods of forming the same

Package structure and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Packages with interposers and methods for forming the same

Integrated fan-out package and method of fabricating the same

Manufacturing method of semiconductor package

Semiconductor structure and manufacturing method thereof

Three-dimensional integrated circuit structures and methods of forming the same

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming same

Semiconductor device and manufacturing method thereof

Semicondutor packages and methods of forming same

Packages with interposers and methods for forming the same

Semiconductor packages and methods of forming the same

3D packages and methods for forming the same

TAIWAN SEMICONDUCTOR MFG

3D packages and methods for forming the same

3D packages and methods for forming the same