Inventor

HUNG LI-WEN

US65 patents

⚠️ This page may combine multiple inventors who share the name “HUNG LI-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUNG LI-WEN

IBM

Chip handling and electronic component integration

Method and apparatus to identify a live face image using a thermal radiation sensor and a visual radiation sensor

High speed handling of ultra-small chips by selective laser bonding and debonding

Double layer release temporary bond and debond processes and systems

Double layer release temporary bond and debond processes and systems

System for continuous monitoring of body sounds

Heterogeneous miniaturization platform

Monolithic integration of a III-V optoelectronic device, a filter and a driving circuit

Low temperature adhesive resins for wafer bonding

Inference focus for offline training of SRAM inference engine in binary neural network

Chip handling and electronic component integration

Handler bonding and debonding for semiconductor dies

Chip handling and electronic component integration

Heterogeneous miniaturization platform

Handler bonding and debonding for semiconductor dies

System for continuous monitoring of body sounds

Handler bonding and debonding for semiconductor dies

Light sensitive switch for semiconductor package tamper detection

Handler bonding and debonding for semiconductor dies

Low temperature adhesive resins for wafer bonding

Adhesive resins for wafer bonding

Rapid oxide etch for manufacturing through dielectric via structures

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Low temperature adhesive resins for wafer bonding

Light sensitive switch for semiconductor package tamper detection

Inference focus for offline training of SRAM inference engine in binary neural network

Handler bonding and debonding for semiconductor dies

High speed handling of ultra-small chips by selective laser bonding and debonding

Handler bonding and debonding for semiconductor dies

Heterogeneous miniaturization platform

Infrared detectors and thermal tags for real-time activity monitoring

Planar fabrication of micro-needles

Permanent wafer handlers with through silicon vias for thermalization and qubit modification

Multi-threshold vertical FETs with common gates

Nanowire enabled substrate bonding and electrical contact formation

Quantum circuit with trench capacitor

Electronics miniaturization platform for medication verification and tracking

Thermal tags for real-time activity monitoring and methods for fabricating the same

Handler bonding and debonding for semiconductor dies

Chip handling and electronic component integration

Handler bonding and debonding for semiconductor dies

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Infrared detectors and thermal tags for real-time activity monitoring

Micro-battery using glass package

Thermal tags for real-time activity monitoring and methods for fabricating the same

Thermal tags for real-time activity monitoring and methods for detecting the same

Tag with tunable retro-reflectors

INVENSENSE INC

MEMS device and process for RF and low resistance applications

MEMS device and process for RF and low resistance applications

NGUYEN CLARK TU-CUONG

Etchant-free methods of producing a gap between two layers, and devices produced thereby