Inventor
CHEN WEI-DA
TW3 patents
Patents
3 patentsUS10964653B2Mar 30, 2021
Method of forming a semiconductor device comprising top conductive pads
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations65
US12400834B2Aug 26, 2025
Cantilever with etch chamber flow design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
US11699596B2Jul 11, 2023
Metal etching with in situ plasma ashing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations40