P

Inventor

TSAI TZU-CHUNG

TW30 patents

Patents

30 patents
US10748798B1Aug 18, 2020

Wireless camera wafer for vacuum chamber diagnostics

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations94
US11855130B2Dec 26, 2023

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11721794B2Aug 8, 2023

Method for manufacturing reflective structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11527713B2Dec 13, 2022

Top electrode via with low contact resistance

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11527717B2Dec 13, 2022

Resistive memory cell having a low forming voltage

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11257997B2Feb 22, 2022

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11024774B2Jun 1, 2021

Display device reflector having improved reflectivity

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11881421B2Jan 23, 2024

Semiconductor die carrier structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12568777B2Mar 3, 2026

Top electrode via with low contact resistance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381181B2Aug 5, 2025

Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322679B2Jun 3, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278167B2Apr 15, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12272724B2Apr 8, 2025

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12239035B2Feb 25, 2025

Resistive memory cell having a low forming voltage

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12102019B2Sep 24, 2024

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094925B1Sep 17, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908838B2Feb 20, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742325B2Aug 29, 2023

Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11716913B2Aug 1, 2023

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309491B2Apr 19, 2022

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11131025B2Sep 28, 2021

Wireless camera wafer for vacuum chamber diagnostics

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12590381B2Mar 31, 2026

Electroplating system including an improved base structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12338943B2Jun 24, 2025

Apparatus for storing and transporting semiconductor elements, and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12322623B2Jun 3, 2025

Semiconductor die carrier structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12218180B2Feb 4, 2025

Multi-layered resistor with a tight temperature coefficient of resistance tolerance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11923403B2Mar 5, 2024

Multi-layered resistor with a tight temperature coefficient of resistance tolerance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12249586B2Mar 11, 2025

Film structure for bond pad

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12222542B2Feb 11, 2025

Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11322464B2May 3, 2022

Film structure for bond pad

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10720581B2Jul 21, 2020

Barrier layer for resistive random access memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45