P

Inventor

WANG PEI-HUA

US46 patents
⚠️ This page may combine multiple inventors who share the name “WANG PEI-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

30 patents
US11462541B2Oct 4, 2022

Memory cells based on vertical thin-film transistors

INTEL CORP2 citations73
US11758711B2Sep 12, 2023

Thin-film transistor embedded dynamic random-access memory with shallow bitline

INTEL CORP2 citations72
US11393927B2Jul 19, 2022

Memory cells based on thin-film transistors

INTEL CORP2 citations72
US11329047B2May 10, 2022

Thin-film transistor embedded dynamic random-access memory with shallow bitline

INTEL CORP4 citations72
US11121073B2Sep 14, 2021

Through plate interconnect for a vertical MIM capacitor

INTEL CORP2 citations70
US12238913B2Feb 25, 2025

Two transistor memory cell using stacked thin-film transistors

INTEL CORP1 citations64
US12376342B2Jul 29, 2025

Passivation layers for thin film transistors

INTEL CORP0 citations62
US12310001B2May 20, 2025

Decoupling capacitors and methods of fabrication

INTEL CORP1 citations62
US12080643B2Sep 3, 2024

Integrated circuit structures having differentiated interconnect lines in a same dielectric layer

INTEL CORP0 citations62
US11955560B2Apr 9, 2024

Passivation layers for thin film transistors and methods of fabrication

INTEL CORP1 citations62
US11929415B2Mar 12, 2024

Thin film transistors with offset source and drain structures and process for forming such

INTEL CORP0 citations62
US11683929B2Jun 20, 2023

Method for making memory cells based on thin-film transistors

INTEL CORP0 citations62
US12426247B2Sep 23, 2025

Capacitor connections in dielectric layers

INTEL CORP0 citations61
US12150297B2Nov 19, 2024

Thin film transistors having a backside channel contact for high density memory

INTEL CORP0 citations61
US12080781B2Sep 3, 2024

Fabrication of thin film fin transistor structure

INTEL CORP0 citations61
US11991873B2May 21, 2024

Capacitor separations in dielectric layers

INTEL CORP0 citations61
US11832438B2Nov 28, 2023

Capacitor connections in dielectric layers

INTEL CORP0 citations61
US11810980B2Nov 7, 2023

Channel formation for three dimensional transistors

INTEL CORP0 citations61
US11610894B2Mar 21, 2023

Capacitor separations in dielectric layers

INTEL CORP0 citations61
US11784088B2Oct 10, 2023

Isolation gap filling process for embedded dram using spacer material

INTEL CORP0 citations60
US12513970B2Dec 30, 2025

Integrated circuits with tungsten interconnect liners

INTEL CORP0 citations59
US12176284B2Dec 24, 2024

Through plate interconnect for a vertical MIM capacitor

INTEL CORP0 citations59
US11563107B2Jan 24, 2023

Method of contact patterning of thin film transistors for embedded DRAM using a multi-layer hardmask

INTEL CORP0 citations59
US12599032B2Apr 7, 2026

Bilayer memory stacking with lines shared between bottom and top memory layers

INTEL CORP0 citations52
US11908911B2Feb 20, 2024

Thin film transistors with raised source and drain contacts and process for forming such

INTEL CORP0 citations52
US11450669B2Sep 20, 2022

Stacked thin-film transistor based embedded dynamic random-access memory

INTEL CORP0 citations52
US11404536B2Aug 2, 2022

Thin-film transistor structures with gas spacer

INTEL CORP0 citations51
US12446208B2Oct 14, 2025

Multilevel wordline assembly for embedded DRAM

INTEL CORP0 citations50
US11950407B2Apr 2, 2024

Memory architecture with shared bitline at back-end-of-line

INTEL CORP0 citations50
US11652047B2May 16, 2023

Intermediate separation layers at the back-end-of-line

INTEL CORP0 citations50

METAL IND RES & DEV CT

8 patents

AFFYMETRIX INC

5 patents

FU GLENN K

2 patents

TEXACO CHEMICAL

1 patent