Inventor

CHANG KEN-YU

TW37 patents

⚠️ This page may combine multiple inventors who share the name “CHANG KEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG KEN-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming hybrid diffusion barrier layer and semiconductor device thereof

Conductive feature formation and structure

Contact conductive feature formation and structure

Contact conductive feature formation and structure

Contact structure and the method of forming the same

Interconnect structures including a fin structure and a metal cap

Liner-free conductive structures

Method of forming conductive feature including cleaning step

Chemical vapor deposition for uniform tungsten growth

Contact conductive feature formation and structure

Capping layer for liner-free conductive structures

Conductive feature formation and structure

Method of forming conductive feature including cleaning step

Conductive feature formation and structure

Contact conductive feature formation and structure

Method of forming conductive feature including cleaning step

Liner-free conductive structures

Capping layer for liner-free conductive structures

Method for forming semiconductor contact structure

Conductive feature formation and structure

Source/drain contact formation methods and devices

Source/drain contact formation methods and devices

Source/drain contact formation methods and devices

Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device

Contact metallization process

Interconnect structure and manufacturing method for the same

Interconnect structure and manufacturing method for the same

Contact metallization process

Method for manufacturing copper layer

Method of forming hybrid diffusion barrier layer and semiconductor device thereof

Gate to source drain interconnects

3DIC with gap-fill structures and the method of manufacturing the same

Method for line stress reduction through dummy shoulder structures

Interface tool and methods of operation

Semiconductor device with TiN adhesion layer for forming a contact plug

TAIWAN SEMICONDUCTOR MFG

Method of forming a copper layer using physical vapor deposition

KUO CHENG CHENG

Dummy shoulder structure for line stress reduction