Inventor
CHIANG KAI-MING
TW7 patents
Patents
7 patentsUS12512419B2Dec 30, 2025
Method of fabricating memory device and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218082B2Feb 4, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11855006B2Dec 26, 2023
Memory device, package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11031376B2Jun 8, 2021
Chip package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12438007B2Oct 7, 2025
Staggered metal mesh on backside of device die and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12512384B2Dec 30, 2025
Semiconductor package with electrically conductive structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12334424B2Jun 17, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48