Inventor

LIN CHIA-MIN

TW23 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHIA-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHIA-MIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method of forming the same

Molded semiconductor device and manufacturing method of molded semiconductor device

Molding apparatus and manufacturing method of molded semiconductor device

Molding apparatus and manufacturing method of molded semiconductor device

Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device

Method of fabricating memory device and package structure

Three-dimensional integrated circuit structures and methods of forming the same

Package structure

Memory device, package structure and fabricating method thereof

Three-dimensional integrated circuit structures and methods of forming the same

Semiconductor structure and circuit structure

Semiconductor structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and method of fabricating the same

INVENSENSE INC

Pressure sensor with deformable membrane and method of manufacture

Pressure sensor

Pressure sensor

Pressure sensor

UNIV NAT CHENG KUNG

Multi-point temperature sensing method for integrated circuit chip and system of the same

Fixed-outline floorplanning approach for mixed-size modules

NCKU RES AND DEVELOPMENT FOUNDATION

Method of macro placement and a non-transitory computer readable medium thereof

Method of placing macro cells and a simulated-evolution-based macro refinement method

GLOBAL UNICHIP CORP

Placement method and non-transitory computer readable storage medium