Inventor
WENG SHENG-FENG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “WENG SHENG-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
21 patentsUS9818729B1Nov 14, 2017
Package-on-package structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD35 citations94
US9859229B2Jan 2, 2018
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations84
US12358194B2Jul 15, 2025
Molded semiconductor device and manufacturing method of molded semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12011859B2Jun 18, 2024
Molding apparatus and manufacturing method of molded semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955460B2Apr 9, 2024
Advanced info POP and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11731327B2Aug 22, 2023
Molding apparatus and manufacturing method of molded semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11446851B2Sep 20, 2022
Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10797025B2Oct 6, 2020
Advanced INFO POP and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12568854B2Mar 3, 2026
Semiconductor packages having semiconductor blocks surrounding semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12512419B2Dec 30, 2025
Method of fabricating memory device and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230549B2Feb 18, 2025
Three-dimensional integrated circuit structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218082B2Feb 4, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11855006B2Dec 26, 2023
Memory device, package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11309226B2Apr 19, 2022
Three-dimensional integrated circuit structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12593732B2Mar 31, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10325883B2Jun 18, 2019
Package-on-package structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10283470B2May 7, 2019
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12354997B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12512384B2Dec 30, 2025
Semiconductor package with electrically conductive structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12354929B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12334424B2Jun 17, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
HON HAI PREC IND CO LTD
5 patentsUS9646442B2May 9, 2017
Electronic lock and method for wirelessly unlocking the electronic lock
HON HAI PREC IND CO LTD1 citations46
US9503669B2Nov 22, 2016
Smart control device and method for controlling television set
HON HAI PREC IND CO LTD1 citations46
US9338809B2May 10, 2016
System for coupling mobile device to host computer of automobile and method thereof
HON HAI PREC IND CO LTD0 citations46
US9904402B2Feb 27, 2018
Mobile terminal and method for input control
HON HAI PREC IND CO LTD0 citations35
US10503772B2Dec 10, 2019
Device and method for recommending multimedia file to user
HON HAI PREC IND CO LTD0 citations32