Inventor
BEYER AXEL
KR8 patents
Patents
8 patentsUS12083705B2Sep 10, 2024
Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
SILTRONIC AG2 citations67
US12479128B2Nov 25, 2025
Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
SILTRONIC AG0 citations57
US12381074B2Aug 5, 2025
Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer
SILTRONIC AG0 citations56
US11658022B2May 23, 2023
Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer
SILTRONIC AG0 citations56
US11158549B2Oct 26, 2021
Method, control system and plant for processing a semiconductor wafer, and semiconductor wafer
SILTRONIC AG1 citations56
US12479129B2Nov 25, 2025
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
SILTRONIC AG0 citations47
US12311455B2May 27, 2025
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
SILTRONIC AG0 citations47
US12325081B2Jun 10, 2025
Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
SILTRONIC AG0 citations46