Inventor

MURAKAMI KANJI

JP24 patents

⚠️ This page may combine multiple inventors who share the name “MURAKAMI KANJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURAKAMI KANJI

HITACHI LTD

Composite article comprising a copper element and a process for producing it

Method of bonding copper and resin

Method for manufacture of printed wiring board

Process for producing printed circuit board

Electroless copper solution

Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition

Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material

Process for producing printed circuit boards

Process for electroless copper plating

Process for electroless copper plating and apparatus used therefor

Printed circuit board, process for preparing the same and resist ink used therefor

Process for producing copper barrier type, nuclear fuel cladding

Process for forming printed wiring by electroless deposition

Process for producing printed circuit board

Process for producing printed circuit board by electroless plating

Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon

MURAKAMI KANJI

Three-dimensional shooting video camera apparatus

Multisensation creation apparatus employing stereoscopic imagery

Atmosphere control apparatus for theaters

Atmosphere control apparatus for theaters

HITACHI CHEMICAL CO LTD

Multiple wire adhesive on a multiple wire wiring board

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

Process for producing multiple wire wiring board

Electroless gold plating solution and method for electroless plating