Inventor
TANIGAWA TAKAO
JP13 patents
⚠️ This page may combine multiple inventors who share the name “TANIGAWA TAKAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
10 patentsUS9828466B2Nov 28, 2017
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
HITACHI CHEMICAL CO LTD4 citations72
US11286346B2Mar 29, 2022
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
HITACHI CHEMICAL CO LTD2 citations70
US10506705B2Dec 10, 2019
Multilayer transmission line plate
HITACHI CHEMICAL CO LTD3 citations70
US11359055B2Jun 14, 2022
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations61
US10957964B2Mar 23, 2021
Multilayer transmission line plate
HITACHI CHEMICAL CO LTD0 citations60
US11377546B2Jul 5, 2022
Resin composition, laminate sheet, and multilayer printed wiring board
HITACHI CHEMICAL CO LTD1 citations59
US11339251B2May 24, 2022
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
HITACHI CHEMICAL CO LTD1 citations59
US10907029B2Feb 2, 2021
Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
HITACHI CHEMICAL CO LTD0 citations59
US11041045B2Jun 22, 2021
Resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
US10519279B2Dec 31, 2019
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
RESONAC CORP
2 patentsUS12324105B2Jun 3, 2025
Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package
RESONAC CORP0 citations59
US12024624B2Jul 2, 2024
Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
RESONAC CORP0 citations56