Inventor
MIZUNO YASUYUKI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “MIZUNO YASUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
13 patentsUS6667107B2Dec 23, 2003
Thermosetting resin composition and use thereof
HITACHI CHEMICAL CO LTD18 citations92
US6156831ADec 5, 2000
Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
HITACHI CHEMICAL CO LTD18 citations90
US7157506B2Jan 2, 2007
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
HITACHI CHEMICAL CO LTD7 citations73
US9828466B2Nov 28, 2017
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
HITACHI CHEMICAL CO LTD4 citations72
US11432400B2Aug 30, 2022
Interlayer insulating film and method for producing same
HITACHI CHEMICAL CO LTD2 citations71
US11359055B2Jun 14, 2022
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations61
US7816430B2Oct 19, 2010
Composition of polycyanate ester and biphenyl epoxy resin
HITACHI CHEMICAL CO LTD3 citations61
US6465083B1Oct 15, 2002
Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the composition
HITACHI CHEMICAL CO LTD3 citations60
US11930594B2Mar 12, 2024
Adhesive film for multilayer printed-wiring board
HITACHI CHEMICAL CO LTD0 citations51
US11041045B2Jun 22, 2021
Resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
US10519279B2Dec 31, 2019
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
US7078106B2Jul 18, 2006
Thermosetting resin composition and use thereof
HITACHI CHEMICAL CO LTD1 citations51
US10251265B2Apr 2, 2019
Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
HITACHI CHEMICAL CO LTD0 citations36
MIZUNO YASUYUKI
3 patentsUS8568891B2Oct 29, 2013
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI3 citations58
US8277948B2Oct 2, 2012
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI3 citations58
US8501870B2Aug 6, 2013
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
MIZUNO YASUYUKI0 citations48