P

Inventor

MIZUNO YASUYUKI

JP20 patents
⚠️ This page may combine multiple inventors who share the name “MIZUNO YASUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

13 patents
US6667107B2Dec 23, 2003

Thermosetting resin composition and use thereof

HITACHI CHEMICAL CO LTD18 citations92
US6156831ADec 5, 2000

Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same

HITACHI CHEMICAL CO LTD18 citations90
US7157506B2Jan 2, 2007

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

HITACHI CHEMICAL CO LTD7 citations73
US9828466B2Nov 28, 2017

Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

HITACHI CHEMICAL CO LTD4 citations72
US11432400B2Aug 30, 2022

Interlayer insulating film and method for producing same

HITACHI CHEMICAL CO LTD2 citations71
US11359055B2Jun 14, 2022

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

HITACHI CHEMICAL CO LTD0 citations61
US7816430B2Oct 19, 2010

Composition of polycyanate ester and biphenyl epoxy resin

HITACHI CHEMICAL CO LTD3 citations61
US6465083B1Oct 15, 2002

Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the composition

HITACHI CHEMICAL CO LTD3 citations60
US11930594B2Mar 12, 2024

Adhesive film for multilayer printed-wiring board

HITACHI CHEMICAL CO LTD0 citations51
US11041045B2Jun 22, 2021

Resin composition, prepreg, laminate and multilayer printed wiring board

HITACHI CHEMICAL CO LTD0 citations51
US10519279B2Dec 31, 2019

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

HITACHI CHEMICAL CO LTD0 citations51
US7078106B2Jul 18, 2006

Thermosetting resin composition and use thereof

HITACHI CHEMICAL CO LTD1 citations51
US10251265B2Apr 2, 2019

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

HITACHI CHEMICAL CO LTD0 citations36

MIZUNO YASUYUKI

3 patents

RIKEN VINYL IND

2 patents

KONDOU YUUSUKE

1 patent

FUJIMOTO DAISUKE

1 patent