Inventor
FUKUDA TOMIO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “FUKUDA TOMIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
20 patentsUS6696155B1Feb 24, 2004
Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances
HITACHI CHEMICAL CO LTD34 citations92
US4526838AJul 2, 1985
Polyamino-bis-imide resin
HITACHI CHEMICAL CO LTD43 citations92
US6524717B1Feb 25, 2003
Prepreg, metal-clad laminate, and printed circuit board obtained from these
HITACHI CHEMICAL CO LTD27 citations90
US6572968B2Jun 3, 2003
Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards
HITACHI CHEMICAL CO LTD11 citations73
US6462147B1Oct 8, 2002
Epoxy resin compositions for printed circuit board and printed circuit board using the same
HITACHI CHEMICAL CO LTD10 citations73
US6329474B1Dec 11, 2001
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole
HITACHI CHEMICAL CO LTD10 citations73
US4707316ANov 17, 1987
Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer
HITACHI CHEMICAL CO LTD6 citations73
US4598115AJul 1, 1986
Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer
HITACHI CHEMICAL CO LTD8 citations73
US9828466B2Nov 28, 2017
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
HITACHI CHEMICAL CO LTD4 citations72
US11286346B2Mar 29, 2022
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
HITACHI CHEMICAL CO LTD2 citations70
US10506705B2Dec 10, 2019
Multilayer transmission line plate
HITACHI CHEMICAL CO LTD3 citations70
US6706409B2Mar 16, 2004
Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
HITACHI CHEMICAL CO LTD3 citations62
US6180250B1Jan 30, 2001
Epoxy composition for printed circuit boards
HITACHI CHEMICAL CO LTD5 citations62
US11359055B2Jun 14, 2022
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations61
US10957964B2Mar 23, 2021
Multilayer transmission line plate
HITACHI CHEMICAL CO LTD0 citations60
US11339251B2May 24, 2022
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
HITACHI CHEMICAL CO LTD1 citations59
US11041045B2Jun 22, 2021
Resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
US10519279B2Dec 31, 2019
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
HITACHI CHEMICAL CO LTD0 citations51
US6692792B2Feb 17, 2004
Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
HITACHI CHEMICAL CO LTD0 citations51
US10876000B2Dec 29, 2020
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
HITACHI CHEMICAL CO LTD0 citations45