Inventor

MURAI HIKARI

JP36 patents

⚠️ This page may combine multiple inventors who share the name “MURAI HIKARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURAI HIKARI

HITACHI CHEMICAL CO LTD

Method of producing metal clad laminate

Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Aerogel

Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Sol composition

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Production method for aerogel laminate, and aerogel laminate roll

Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

Adhesive film for multilayer printed-wiring board

Resin composition, prepreg, laminate and multilayer printed wiring board

Aerogel

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Aerogel laminate and thermal insulation material

Production method for aerogel laminate, and aerogel laminate roll

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

MIZUNO YASUYUKI

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

TSUCHIKAWA SHINJI

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate

KOTAKE TOMOHIKO

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Prepreg, laminate obtained with the same and printed-wiring board

FUJIMOTO DAISUKE

Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

MORITA KOUJI

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

NAGAI SHUNSUKE

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

MIYATAKE MASATO

Resin composition, prepreg laminate obtained with the same and printed-wiring board