Inventor
FUJII HIROFUMI
JP76 patents
⚠️ This page may combine multiple inventors who share the name “FUJII HIROFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
19 patentsUS6662442B1Dec 16, 2003
Process for manufacturing printed wiring board using metal plating techniques
NITTO DENKO CORP100 citations97
US6591491B2Jul 15, 2003
Method for producing multilayer circuit board
NITTO DENKO CORP53 citations93
US6904674B2Jun 14, 2005
Process for manufacturing a printed wiring board
NITTO DENKO CORP23 citations92
US6379159B1Apr 30, 2002
Interposer for chip size package and method for manufacturing the same
NITTO DENKO CORP40 citations92
US7235888B2Jun 26, 2007
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP15 citations84
US6858473B2Feb 22, 2005
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP12 citations80
US7371506B2May 13, 2008
Positive photosensitive resin composition
NITTO DENKO CORP7 citations74
US6746816B2Jun 8, 2004
Photosensitive resin composition and circuit board
NITTO DENKO CORP7 citations74
US6300037B1Oct 9, 2001
Photosensitive resin composition and adhesive
NITTO DENKO CORP11 citations74
US6048663AApr 11, 2000
Negative-working photoresist compositions and and use thereof
NITTO DENKO CORP10 citations74
US5665523ASep 9, 1997
Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern
NITTO DENKO CORP9 citations74
US7575812B2Aug 18, 2009
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
NITTO DENKO CORP7 citations72
US5851736ADec 22, 1998
Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
NITTO DENKO CORP15 citations71
US8026045B2Sep 27, 2011
Method of manufacturing wiring circuit board
NITTO DENKO CORP5 citations63
US6889426B2May 10, 2005
Method for manufacturing wired circuit board
NITTO DENKO CORP6 citations63
US6623843B2Sep 23, 2003
Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board
NITTO DENKO CORP5 citations63
US7037637B2May 2, 2006
Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide
NITTO DENKO CORP2 citations61
US7910631B2Mar 22, 2011
Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition
NITTO DENKO CORP6 citations60
US7793668B2Sep 14, 2010
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them
NITTO DENKO CORP5 citations59
KOBE STEEL LTD
6 patentsUS7258912B2Aug 21, 2007
Hard laminated film, method of manufacturing the same and film-forming device
KOBE STEEL LTD45 citations95
US6767627B2Jul 27, 2004
Hard film, wear-resistant object and method of manufacturing wear-resistant object
KOBE STEEL LTD52 citations95
US6334405B1Jan 1, 2002
Vacuum arc evaporation source and vacuum arc vapor deposition apparatus
KOBE STEEL LTD23 citations92
US5730847AMar 24, 1998
Arc ion plating device and arc ion plating system
KOBE STEEL LTD43 citations90
US5744017AApr 28, 1998
Vacuum arc deposition apparatus
KOBE STEEL LTD15 citations72
US7955673B2Jun 7, 2011
PVD cylindrical target
KOBE STEEL LTD2 citations61
SHINKO ELECTRIC IND CO
5 patentsUS5410180AApr 25, 1995
Metal plane support for multi-layer lead frames and a process for manufacturing such frames
SHINKO ELECTRIC IND CO220 citations98
US5291060AMar 1, 1994
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO43 citations92
US5237202AAug 17, 1993
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO52 citations92
US5235209AAug 10, 1993
Multi-layer lead frame for a semiconductor device with contact geometry
SHINKO ELECTRIC IND CO36 citations92
US5854094ADec 29, 1998
Process for manufacturing metal plane support for multi-layer lead frames
SHINKO ELECTRIC IND CO6 citations62
FUJII HIROFUMI
3 patentsNITTAN CO LTD
2 patentsPANASONIC IP MAN CO LTD
2 patentsPANASONIC CORP
2 patentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
1 patentYOKOMITSU SUMIO
1 patentMATSUMOTO YUICHI
1 patentHITACHI LTD
1 patentFUJIMATSU TAKESHI
1 patentTANIFUJI SHINICHI
1 patentCANON KK
1 patentWATANABE TAKESHI
1 patentYAMAMOTO KENJI
1 patentNITTO SHINKO CORP
1 patentTOSHIBA ENERGY SYSTEMS & SOLUTIONS CORP
1 patentShowing the top 50 of 76 patents by PatentIndex Score.