P

Inventor

FUJII HIROFUMI

JP76 patents
⚠️ This page may combine multiple inventors who share the name “FUJII HIROFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

19 patents
US6662442B1Dec 16, 2003

Process for manufacturing printed wiring board using metal plating techniques

NITTO DENKO CORP100 citations97
US6591491B2Jul 15, 2003

Method for producing multilayer circuit board

NITTO DENKO CORP53 citations93
US6904674B2Jun 14, 2005

Process for manufacturing a printed wiring board

NITTO DENKO CORP23 citations92
US6379159B1Apr 30, 2002

Interposer for chip size package and method for manufacturing the same

NITTO DENKO CORP40 citations92
US7235888B2Jun 26, 2007

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

NITTO DENKO CORP15 citations84
US6858473B2Feb 22, 2005

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

NITTO DENKO CORP12 citations80
US7371506B2May 13, 2008

Positive photosensitive resin composition

NITTO DENKO CORP7 citations74
US6746816B2Jun 8, 2004

Photosensitive resin composition and circuit board

NITTO DENKO CORP7 citations74
US6300037B1Oct 9, 2001

Photosensitive resin composition and adhesive

NITTO DENKO CORP11 citations74
US6048663AApr 11, 2000

Negative-working photoresist compositions and and use thereof

NITTO DENKO CORP10 citations74
US5665523ASep 9, 1997

Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern

NITTO DENKO CORP9 citations74
US7575812B2Aug 18, 2009

Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor

NITTO DENKO CORP7 citations72
US5851736ADec 22, 1998

Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern

NITTO DENKO CORP15 citations71
US8026045B2Sep 27, 2011

Method of manufacturing wiring circuit board

NITTO DENKO CORP5 citations63
US6889426B2May 10, 2005

Method for manufacturing wired circuit board

NITTO DENKO CORP6 citations63
US6623843B2Sep 23, 2003

Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board

NITTO DENKO CORP5 citations63
US7037637B2May 2, 2006

Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide

NITTO DENKO CORP2 citations61
US7910631B2Mar 22, 2011

Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition

NITTO DENKO CORP6 citations60
US7793668B2Sep 14, 2010

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

NITTO DENKO CORP5 citations59

KOBE STEEL LTD

6 patents

SHINKO ELECTRIC IND CO

5 patents

FUJII HIROFUMI

3 patents

NITTAN CO LTD

2 patents

PANASONIC IP MAN CO LTD

2 patents

PANASONIC CORP

2 patents

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

1 patent

YOKOMITSU SUMIO

1 patent

MATSUMOTO YUICHI

1 patent

HITACHI LTD

1 patent

FUJIMATSU TAKESHI

1 patent

TANIFUJI SHINICHI

1 patent

CANON KK

1 patent

WATANABE TAKESHI

1 patent

YAMAMOTO KENJI

1 patent

NITTO SHINKO CORP

1 patent

TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORP

1 patent

Showing the top 50 of 76 patents by PatentIndex Score.